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Camera module for improving flatness as well as photosensitive component and manufacturing method thereof

A technology of a camera module and a manufacturing method, which is applied to parts of color TVs, parts of TV systems, electrical components, etc., can solve problems such as uneven attachment

Active Publication Date: 2018-06-29
NINGBO SUNNY OPOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, when most PCB substrates are used for attaching microactuators (MEMS actuators), the attachment of microactuators (MEMS actuators) will be uneven and will further interfere with the photosensitive sensor of the camera module. About 9-10% defective rate after component attaching

Method used

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  • Camera module for improving flatness as well as photosensitive component and manufacturing method thereof
  • Camera module for improving flatness as well as photosensitive component and manufacturing method thereof
  • Camera module for improving flatness as well as photosensitive component and manufacturing method thereof

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Embodiment Construction

[0038] The following description serves to disclose the present invention to enable those skilled in the art to carry out the present invention. The preferred embodiments described below are only examples, and those skilled in the art can devise other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents and other technical solutions without departing from the spirit and scope of the present invention.

[0039] Those skilled in the art should understand that in the disclosure of the present invention, the terms "vertical", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientation or positional relationship indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present invention...

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Abstract

The invention discloses a camera module for improving flatness as well as a photosensitive component and a manufacturing method thereof. The camera module comprises at least one circuit board structure, at least one micro-actuator, at least one photosensitive element, at least one optical filter, at least one lens and at least one focusing mechanism, wherein the optical filter is arranged betweenthe photosensitive element and the lens, the lens is located on a photosensitive path of the photosensitive element and is mounted on the focusing mechanism, the circuit board structure comprises at least one circuit board and at least one leveling board, the leveling board is adhered to the circuit board to improve the flatness, the micro-actuator is suitable for being attached to the leveling board, and the photosensitive element is attached to the micro-actuator.

Description

technical field [0001] The present invention relates to a circuit board structure, in particular to a ceramic circuit board structure applied to a camera module and a manufacturing method thereof, wherein the ceramic circuit board structure is applied to a micro-actuator by adding a leveling plate. The yield rate of the attached process is improved, and the flatness is improved. Background technique [0002] With the advancement of science and technology and the convenience of life, various electronic products around people's lives are also developing rapidly, especially in response to the development of micro-electro-mechanical systems, which makes various products miniaturized and intelligent. With the successful development of MEMS technology, many MEMS components such as micro-sensors (MEMS sensors) and micro-actuators (MEMS actuators) are gradually produced. In particular, products using micro-electro-mechanical systems have the advantages of increased strength, enhanc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225
CPCH04N23/50H04N23/57
Inventor 陈飞帆刘旭辉方银丽周胄郭巍
Owner NINGBO SUNNY OPOTECH CO LTD
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