Unlock instant, AI-driven research and patent intelligence for your innovation.

Mold cleaning fixture and mold cleaning system

A fixture and mold cleaning technology, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems that the lead frame cannot be reused, waste of resources, difficulty in release, etc., so as to avoid adhesion on the mold cleaning fixture and reduce The cost of mold cleaning and the effect of avoiding waste of resources

Active Publication Date: 2020-10-30
WUXI CHINA RESOURCES HUAJING MICROELECTRONICS
View PDF16 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If it is not removed in time, it will not only cause difficulty in releasing the package and defects in the appearance of the package
[0003] In related technologies, the commonly used method of mold cleaning is to use the metal lead frame used in the mass production of discrete devices, which is realized by injection molding of resin cake material for mold cleaning. Moreover, after the mold is cleaned, the lead frame needs to be air-sealed. Normal mass production can only be done after the appearance of the plastic package is normal. Since the lead frame cannot be reused after mold cleaning, the cost of mold cleaning is high, and there is a problem of waste of resources.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mold cleaning fixture and mold cleaning system
  • Mold cleaning fixture and mold cleaning system
  • Mold cleaning fixture and mold cleaning system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] see image 3 and Figure 4 The mold cleaning jig 2 provided by Embodiment 1 of the present application includes: a jig body 21, a positioning hole 23 provided on the jig body 21, and pins 22 set on the jig body 21, wherein the pins 22 are from One side of the clamp body 21 protrudes to cooperate with the tooth groove 34 on the injection mold 3 .

[0033] see Figure 4 , when cleaning the mold, the pin 22 of the mold cleaning jig 2 is first embedded in the tooth groove 34 on the injection mold 3 . Wherein, the injection mold 3 is equipped with positioning pins (not shown in the figure), when inserting the pin 22 of the mold cleaning jig 2 into the tooth groove 34 on the injection mold 3, first pass the positioning pins on the injection mold 3 into the cleaning pins. In the corresponding positioning hole 23 on the mold fixture 2, align the pins 22 on the fixture body 21 with the corresponding tooth grooves 34 on the injection mold 3, and then insert the pins 22 of the ...

Embodiment 2

[0054] Embodiment 2 of the present application provides a mold cleaning jig. Embodiment 2 is roughly the same as Embodiment 1, the main difference is that in Embodiment 1, the mold cleaning jig has three positioning holes 23, which are used to avoid the pins 22 on the mold cleaning jig 2 and the tooth grooves on the injection mold 3 34 dislocations. And in example two, see Figure 5 , the mold cleaning jig has not only three positioning holes 23, but also two positioning holes 24 for arranging the mold cleaning jig on the injection mold 3 through the supporting needle. When feeding, use two support needles to pass through the two positioning holes 24 to hold up the entire mold cleaning jig 2, place the mold cleaning jig 2 on the injection mold 3, and complete the loading, which is simple to implement.

Embodiment 3

[0056] Embodiment 3 of the present application provides a mold cleaning jig. The third embodiment is roughly the same as the second embodiment, the main difference is: in the second embodiment, please refer to Figure 5 , the mold cleaning jig 2 not only has three positioning holes 23, but also has two positioning holes 24, which are used to arrange the mold cleaning jig on the injection mold 3 by supporting the needle. And in Example 3, see Figure 6 The mold clearing fixture 2 also includes at least two relief holes 25 arranged on the fixture body 2 for passing through the support pins. The relief holes 25 are arranged on the other side of the fixture body 21 opposite to the side where the pin 22 is set. . When feeding, use the 2 supporting needles on the supporting sheet of the feeding device to pass through the 2 relief holes 25 respectively, hold up the entire mold cleaning jig 2, place the mold cleaning jig 2 on the injection mold 3, and complete the loading process. ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a mold cleaning clamp and a mold cleaning system. The mold cleaning clamp comprises a clamp body, a positioning hole disposed in the clamp body, and a pin disposed on the clampbody. The pin extends from one side of the clamp body for cooperating with a tooth space in an injection mold. The invention is advantageous in that the clamp body is provided with the pin cooperatingwith the tooth space in the injection mold, and thereby during mold cleaning, only the end face of the pin, facing the tooth space can contact with the mold-cleaning biscuit; as the tooth space is small in volume, and the pin cooperating with the tooth space is small in volume, and the area of the end face of the pin, facing the tooth space is quite small, and thereby even if the mold-cleaning biscuit has adherence, it cannot be adhered to the pin, and the mold-cleaning biscuit cannot contact with other parts of the mold-cleaning clamp; the mold-cleaning biscuit can be prevented from being adhered to the mold-cleaning clamp, and the mold-cleaning clamp can be repetitively used, and thereby mold-cleaning cost can be reduced, and resource waste can be prevented.

Description

technical field [0001] The present application relates to the mold cleaning technology of semiconductor packaging, in particular to a mold cleaning fixture and a mold cleaning system. Background technique [0002] In the packaging process of electronic discrete devices, the cleaning of plastic packaging molds is a very important process. In continuous molding operations, part of the components from the molding compound and release agent are oxidized under high temperature (170°C-180°C), and adhere to the surface of the mold, forming dirt that is difficult to remove. If it is not removed in time, it will not only cause difficulty in releasing the package and defects in the appearance of the package. [0003] In related technologies, the commonly used method of mold cleaning is to use the metal lead frame used in the mass production of discrete devices, which is realized by injection molding of resin cake material for mold cleaning. Moreover, after the mold is cleaned, the le...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56
CPCH01L21/566H01L2224/97
Inventor 季刚吴泽星卫勇峰林志杰
Owner WUXI CHINA RESOURCES HUAJING MICROELECTRONICS
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com