Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

High-flux gene sequencing instrument base

A gene sequencer and high-throughput technology, applied in the field of next-generation high-throughput gene sequencers and sequencing chips, can solve problems such as the inability to adjust the angle and direction, and the inability to adapt to the operating needs of different environments.

Inactive Publication Date: 2018-07-06
张士伟 +1
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the process of realizing the present invention, the inventors found at least the following problems in the prior art: in the traditional technology, the gene sequencer is fixedly installed on the base, its angle and direction cannot be adjusted, and cannot adapt to the operating requirements of different environments

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-flux gene sequencing instrument base

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0017] see figure 1 , a high-throughput gene sequencer base, has:

[0018] The lower base has three lower support arms, the first ends of the three lower support arms are connected together, and the angle between two adjacent lower support arms is 120°;

[0019] The upper base has three upper support arms, the first ends of the three upper support arms are connected together, and the angle between two adjacent upper support arms is 120°;

[0020] The upper base is located above the lower base, and the upper support arm of the upper base and the lower support arm of the lower base are staggered from each other;

[0021] Piston cylinders, two piston cylinders are arranged on the second end of each lower support arm, and the piston rods...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a high-flux gene sequencing instrument base. The high-flux gene sequencing instrument base is provided with a lower foundation support, an upper foundation support and piston cylinders, wherein the lower foundation support is provided with three lower supporting arms, first ends of the three lower supporting arms are connected together, and an angle of two adjacent lower supporting arms is 120 degrees; the upper foundation support is provided with three upper supporting arms, first ends of the three upper supporting arms are connected together, and an angle of two adjacent upper supporting arms is 120 degrees; the upper foundation support is disposed above the lower foundation support, and the upper supporting arms of the upper foundation support are staggered to the lower supporting arms of the lower foundation support; and a second end of each lower supporting arm is provided with two piston cylinders, piston rods of the two piston cylinders on one lower supporting arm are respectively connected with two adjacent upper supporting arms, a dip angle of the upper foundation support is adjusted by virtue of the extension of a hydraulic cylinder, so that the inclination at different angles in different directions can be realized, and the operation requirements in different environments can be met.

Description

technical field [0001] The invention belongs to the technical field of a new-generation high-throughput gene sequencer and a sequencing chip, and in particular relates to a base of a high-throughput gene sequencer. Background technique [0002] In the process of realizing the present invention, the inventors found at least the following problems in the prior art: In the traditional technology, the gene sequencer is fixedly installed on the base, its angle and direction cannot be adjusted, and cannot adapt to the operating requirements of different environments. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a base of a high-throughput gene sequencer whose angle can be adjusted. [0004] In order to solve the above technical problems, the technical solution adopted in the present invention is: a base of a high-throughput gene sequencer, which has: [0005] The lower base has three lower support arms, the first e...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C12M1/34C12M1/00
CPCC12Q1/6869
Inventor 张士伟凌中鑫
Owner 张士伟
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com