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A Strength Prediction Method Considering Lap Interface Topography and Lap Gradient Properties

A strength prediction and interface technology, which is applied in the directions of instrumentation, design optimization/simulation, calculation, etc., can solve problems such as unevenness of the overlapping surface and sensitivity of the overlapping strength

Active Publication Date: 2020-03-10
CHINA UNIV OF MINING & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current research on bonded lap structures almost considers that the lap surfaces are smooth, but in practice the lap surfaces are likely to be uneven
The lap joint strength is very sensitive to the thickness of the adhesive layer. The thickness of the adhesive layer on the lap joint surface changes gradually due to the roughness of the lap joint. At this time, it is very inaccurate to use the strength of the lap joint surface of the smooth interface to predict the situation of non-smoothness.

Method used

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  • A Strength Prediction Method Considering Lap Interface Topography and Lap Gradient Properties
  • A Strength Prediction Method Considering Lap Interface Topography and Lap Gradient Properties
  • A Strength Prediction Method Considering Lap Interface Topography and Lap Gradient Properties

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Embodiment 1

[0028] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments. What is described below is only some embodiments of the invention. For those skilled in the art, no creative work is required, and the strength of the corresponding bonding system can be obtained only by changing the shape of the specific overlapping interface and the gradient characteristics of the overlapping material.

[0029] 1) figure 2 It is a single lap model after approximately fitting the actual non-smooth lap surface. The upper surface of the overlapping surface is composed of 4 segments of equal length, the absolute value of the slope k of each line segment is 0.4 / 12.5, the lower surface of the overlapping surface is a smooth straight line, the length L of the upper and lower overlapping objects is 200mm, and the thickness h is 5mm, and the lap length l is 50mm. If the origin of the Cartesian coordinate system is established at the...

Embodiment 2

[0045] Example 2, such as image 3 As shown, the gradient characteristic of the adherend in Example 1 is removed, the elastic modulus is taken as 209GPa, and other conditions remain unchanged.

example 3

[0046] Example 3, such as Figure 4 As shown, remove the non-smoothness of the overlapping interface in Example 2 and change it to a smooth interface, and keep other conditions unchanged.

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Abstract

The invention relates to a strength prediction method considering a lap joint interface and a lap joint object gradient property. The method comprises the steps that after fit uneven lap joint face morphology is obtained, a coordinate system is given, and an expression of bonding layer thickness is worked out; modeling is performed through ABAQUS, adherend gradient parameter and adhesive layer parameters are determined according to a model coordinate system; lap joint object gradient material parameters and the parameters of a bonding layer of a rough interface are given to the model by meansof user subprogram USDFLD in the ABAQUS; after all material parameters are given to the model, an analysis step is created, corresponding constraint and boundary conditions are added, and after working condition calculation is created, the strength of the most adhesive system can be extracted.

Description

technical field [0001] The invention belongs to the field of bonding and lapping, in particular to a strength prediction method considering the morphology of the lapping interface and the gradient properties of the lapping object. Background technique [0002] With the rapid development of adhesives, bonded structures are widely used in machinery, construction, aerospace, medicine and other fields. Compared with traditional methods such as nail connection, riveting, and bolt connection, the adhesive bonding technology is not limited by the joint shape of the lap, the stress concentration is small, the bonding structure is light, the connection is well sealed, and the cost is low. characteristics, making it more and more popular. [0003] In specific applications, the damage of the bonded structure often occurs on the bonded interface, so the study of the interface strength is of great significance. As for the research on the strength of the bonded structure, early scholars...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/23G06F119/14
CPCG06F30/23G06F2119/06
Inventor 陈培见郭旺彭娟刘昊赵玉成高峰
Owner CHINA UNIV OF MINING & TECH