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Computer power-supply heat dissipation device

A computer power supply and heat dissipation device technology, which is applied in computing, electrical digital data processing, instruments, etc., can solve the problems that power supply heat dissipation devices cannot effectively achieve heat dissipation and cost consumption, and achieve the goal of improving heat conduction efficiency, realizing changes, and improving adjustments range effect

Active Publication Date: 2018-07-17
WENZHOU POLYTECHNIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the configuration of the computer is upgraded at the user end or the operating environment is relatively special (low temperature / high temperature), the power cooling device matched by the original factory cannot effectively dissipate heat. At this time, it is necessary to upgrade and replace the cooling device at the same time. Brings additional cost consumption

Method used

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  • Computer power-supply heat dissipation device
  • Computer power-supply heat dissipation device
  • Computer power-supply heat dissipation device

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Embodiment Construction

[0020] The standard parts used in the present invention can be purchased from the market, and the special-shaped parts can be customized according to the instructions and the accompanying drawings. The specific connection methods of each part adopt mature bolts, rivets, welding in the prior art , pasting and other conventional means, no longer described in detail here.

[0021] refer to Figure 1-5 , a specific embodiment of the present invention includes a frame 2 fixed on the surface of a computer power supply 1, a number of metal jackets 3 are evenly fixed in the frame 2, a first slide groove 4 is arranged on the edge of the frame 2, and the first groove 4 is inserted into the Connected with a support rod 5, the side of the support rod 5 is provided with a fixing bolt 6, the top of the support rod 5 is fixed with a top cover 7, the bottom surface of the top cover 7 is provided with several metal inner sleeves 8, and the metal inner sleeves 8 are inserted into the metal oute...

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Abstract

The invention discloses a computer power-supply heat dissipation device. The device includes a frame fixed at a surface of a computer power supply. A plurality of metal outer-sleeves are evenly fixedin the frame. Edges of the frame are provided with first chutes. Support rods are inserted and connected in the first slots. Side surfaces of the support rods are provided with fixing bolts. A top cover is fixed at tops of the support rods. A bottom surface of the top cover is provided with a plurality of metal inner-sleeves. The metal inner-sleeves are inserted and connected inside the metal outer-sleeves and are in contact with inner side walls of the metal outer-sleeves. A wind duct communicated with the metal inner-sleeves is disposed inside the top cover. An inlet of the wind duct is connected with a wind inlet pipe. Side walls of the metal outer-sleeves are provided with a plurality of first through holes. The device can alleviate the deficiencies of the prior art, improves matchingflexibility of the heat dissipation device, and can adapt to different heat dissipation requirements.

Description

technical field [0001] The invention relates to a computer accessory, in particular to a computer power cooling device. Background technique [0002] When a computer (especially a high-speed mainframe used by a large server) is running, its power module will generate a lot of heat. It is necessary to configure a special heat dissipation device for real-time heat dissipation. In the prior art, heat sinks used in power modules are mainly divided into two categories: the first type is air-cooled heat sinks, which are mainly used for power modules with low power; the second type is water-cooled heat sinks, which are mainly used for power modules with low power. Large power module. Regardless of the type of cooling device, it is matched and installed according to the factory rated power of the computer when the computer is assembled. If the configuration of the computer is upgraded at the user end or the operating environment is relatively special (low temperature / high tempera...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 龚大丰
Owner WENZHOU POLYTECHNIC
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