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Wafer automatic positioning system and loader including same

An automatic positioning, wafer technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as motion deviation, reduce wafer positioning accuracy, etc., achieve low noise, fast response speed, and small image distortion Effect

Pending Publication Date: 2018-07-20
成功环保科技(南通)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the process of wafer packaging, the wafer is generally placed with the help of a manipulator with a suction cup. During long-term use, the mani

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  • Wafer automatic positioning system and loader including same
  • Wafer automatic positioning system and loader including same
  • Wafer automatic positioning system and loader including same

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Embodiment Construction

[0035] Below in conjunction with specific embodiment, content of the present invention is described in further detail:

[0036] The "up" and "down" referred to below are consistent with the up and down directions of the drawings themselves, but do not limit the structure of the invention. In order to achieve the purpose of the present invention, figure 1 A schematic structural diagram of the first embodiment of the automatic wafer positioning system in the present invention is shown in . The wafer automatic positioning system includes several parts such as an adjustment platform 1, a vacuum generator 4, a manipulator 3, a driving device 5, a laser ranging system 6, a camera system 7, and a first controller 8, wherein the adjustment platform 1 is provided with a An annular vacuum suction groove that absorbs the wafer 2 and is connected with a vacuum generator 4 . In order to realize the movement of the adjustment platform 1 in the directions of X, Y and Z axes, a driving devi...

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Abstract

The invention relates to a wafer automatic positioning system which comprises an adjustment platform, a vacuum generator, a manipulator, a driving device, a laser ranging system, a camera system and afirst controller. After a wafer is initially placed in place, the positioning mark of the wafer is captured in real time by the camera system arranged directly above the wafer, an image is transmitted to the first controller, floating coordinates (X, Y) of the wafer are generated, a Z-phase coordinate value of an upper surface of the wafer is obtained by the laser ranging system, then the coordinate value and a preset coordinate value in the first controller are compared, and a control signal is emitted. The driving device drives the adjustment platform to move in the X, Y, and Z-axis directions according to the control signal, the secondary adjustment of the position of the wafer is carried out, and thus the positioning accuracy of the wafer is improved.

Description

technical field [0001] The invention relates to the field of wafer manufacturing, in particular to an automatic wafer positioning system and a loader including the same. Background technique [0002] In the process of wafer packaging, the wafer is generally placed with the help of a manipulator with a suction cup. During long-term use, the manipulator will experience unavoidable situations such as movement deviation or mechanical vibration, which reduces the positioning of the wafer. precision. However, with the advancement of technology, the requirements for the accuracy of the wafer are getting higher and higher, which also puts forward higher requirements for the positioning accuracy of the placement and loading. How to ensure the positioning accuracy of the wafer during the loading process and reduce the error is A problem to be solved urgently by those skilled in the art. Contents of the invention [0003] The problem to be solved by the present invention is to prov...

Claims

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Application Information

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IPC IPC(8): H01L21/68
CPCH01L21/681
Inventor 黄雷
Owner 成功环保科技(南通)有限公司