Liquid-cooling heat dissipation device
A technology of cooling device and liquid cooling, applied in the direction of cooling/ventilation/heating transformation, can solve the problem of low heat dissipation efficiency, achieve good cooling effect, increase the contact area, and improve the effect of heat dissipation efficiency
Active Publication Date: 2018-07-31
AURAS TECH
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Problems solved by technology
However, since there is no design for guiding the flow of liquid in the action chamber 40, when the liquid enters the action chamber 40, only part of the liquid will pass through the heat dissipation structure 230 below and take away its heat energy, resulting in low heat dissipation efficiency. missing
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[0040] Please also refer to Figure 2A , Figure 2B as well as Figure 2C According to the first embodiment of the present invention, a liquid-cooled heat sink 1 is provided. The liquid cooling heat sink 1 includes a heat conducting base 2 and a cover 3 . The heat conduction base 2 has a bottom surface 21 and a top surface 22 opposite to each other. The bottom surface 21 is used to absorb the heat energy of a heat source 8 after being in contact with the heat source 8 and transfer it to the top surface 22; while the top surface 22 of the heat conduction base 2 is formed with The heat dissipation structure 23 is used to increase the area in contact with the liquid and increase the efficiency of heat dissipation. The cover body 3 is covered on the heat conduction base 2, and together with the heat conduction base 2 defines a water inlet chamber 5 and a water outlet chamber 6, wherein the water inlet chamber 5 is arranged above the heat dissipation structure 23 and has a water...
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A liquid-cooling heat dissipation device includes a thermally conductive base and a covering structure. The thermally conductive base has a bottom surface and a top surface opposed to the bottom surface. The bottom surface is in contact with a heat source. A heat dissipation structure is formed on the top surface. The thermally conductive base is covered by the covering structure. An input chamberand an output chamber are defined by the thermally conductive base and the covering structure collaboratively. The input chamber is disposed over the heat dissipation structure and has an entrance. The output chamber has an exit. The input chamber is a tapered space. A vertical height of the input chamber is gradually decreased in a direction from the entrance toward the exit. Consequently, liquid flowing into the input chamber through the entrance is guided to the heat dissipation structure. Liquid can be guided to the heat dissipation structure to increase the contact area. Consequently, the heat dissipation efficacy is enhanced.
Description
technical field [0001] The present invention relates to a heat dissipation device, in particular to a liquid-cooled heat dissipation device. Background technique [0002] Please also refer to Figure 1A as well as Figure 1B , the existing liquid-cooled heat sink 10 , which is commonly known as a cold plate, has a structure including a heat-conducting base 20 and a cover 30 . The heat conduction base 20 has a bottom surface 210 and a top surface 220 opposite to each other. The bottom surface 210 is used to absorb heat energy and transfer it to the top surface 220 after being in contact with a heat source 80; while the top surface 220 of the heat conduction base 20 forms There is a heat dissipation structure 230 to increase the area in contact with the liquid. The cover body 30 is disposed on the heat conduction base 20 , and defines an action chamber 40 together with the heat conduction base 20 . However, since there is no design for guiding the flow of liquid in the acti...
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IPC IPC(8): H05K7/20
Inventor 吴安智范牧树陈建佑
Owner AURAS TECH