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Cover plate processing technology

A processing technology and cover plate technology, applied in the direction of coating, epoxy resin coating, polyurea/polyurethane coating, etc., can solve the problem that the hardness needs to be further improved, and achieve the effect of improving the wear resistance

Inactive Publication Date: 2018-08-03
浙江欣麟新材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The high-impact mobile phone glass cover plate prepared by the invention has good impact resistance, high wear resistance, good brightness, good water resistance, acid and alkali resistance and aging resistance, but its hardness needs to be improved. Further improve

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] The cover plate processing technology of the present embodiment comprises the following steps:

[0048] 1) Cutting: Select 3D glass and cut it into small pieces;

[0049]2) silk screen printing: perform multiple screen printing on the surface of the board obtained in step 1);

[0050] 3) One-time molding: performing one-time thermosetting molding on the board after screen printing in step 2), wherein the temperature of the thermosetting molding is 80° C., and the time of the thermosetting molding is 3 minutes;

[0051] 4) One-time hardening: Spray the polyurethane acrylic resin hardening liquid on the plate after step 3) one-time molding, and use 400mJ / cm 2 UV light irradiation for 10 minutes for a hardening;

[0052] 5) Secondary molding: performing secondary pressure molding on the plate after the primary hardening in step 4), wherein the pressure of the pressure molding is 10 kg;

[0053] 6) Secondary hardening: spray polyurethane acrylic resin hardening liquid on...

Embodiment 2

[0057] The cover plate processing technology of the present embodiment comprises the following steps:

[0058] 1) Cutting: Select plastic cut into small pieces;

[0059] 2) silk screen printing: perform multiple screen printing on the surface of the board obtained in step 1);

[0060] 3) One-time molding: perform one-time thermosetting molding on the plate after screen printing in step 2), wherein the temperature of the thermosetting molding is 90° C., and the time of the thermosetting molding is 2 minutes;

[0061] 4) One-time hardening: spray polyurethane acrylic resin hardening liquid on the plate after step 3) one-time molding, and use 500mJ / cm 2 UV light irradiation for 8 minutes for a hardening;

[0062] 5) Secondary forming: performing secondary heating and forming on the board after the primary hardening in step 4), wherein the temperature of the heating forming is 130°C, and the time of the heating forming is 30s;

[0063] 6) Secondary hardening: Spray polyurethane...

Embodiment 3

[0067] The cover plate processing technology of the present embodiment comprises the following steps:

[0068] 1) Cutting: Select plastic cut into small pieces;

[0069] 2) silk screen printing: perform multiple screen printing on the surface of the board obtained in step 1);

[0070] 3) One-time molding: performing one-time thermosetting molding on the board after step 2) screen printing, wherein the temperature of the thermosetting molding is 120°C, and the time of the thermosetting molding is 50s;

[0071] 4) One-time hardening: Spray the epoxy resin hardening liquid on the plate after step 3) one-time molding, and use 600mJ / cm 2 UV light irradiation for 5 minutes for a hardening;

[0072] 5) Secondary molding: performing secondary pressure molding on the plate after the primary hardening in step 4), wherein the pressure of the pressure molding is 40 kg;

[0073] 6) Secondary hardening: Spray the epoxy resin hardening liquid on the plate after step 5) secondary molding, ...

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Abstract

The invention provides a cover plate processing technology. The cover plate processing technology comprises steps as follows: 1) cutting: raw materials are selected and cut into a small plate; 2) silkprinting: multiple silk-screen printing is performed on the surface of the plate obtained in step 1); 3) primary molding: the plate subjected to silk-screen printing in the step 2) is subjected to primary thermosetting molding; 4) primary hardening: a hardening liquid is sprayed to the plate obtained after primary molding in the step 3) for primary hardening; 5) secondary molding: the plate obtained after primary hardening in the step 4) is subjected to secondary heating / pressurized molding; 6) secondary hardening: a hardening liquid is sprayed to the plate obtained after secondary molding inthe step 5) for secondary hardening; 7) cleaning: the plate obtained after secondary hardening in the step 6) is cleaned, and the cover plate is obtained. The cover plate produced with the cover plate processing technology has high hardness and good wear resistance, and the processing technology can be widely applied to processing of cover plates of a mobile phone, a computer and other electronicproducts.

Description

technical field [0001] The invention belongs to the technical field of cover plate processing, and relates to a cover plate processing technology. Background technique [0002] With the development of electronic technology and the increasing requirements of users on the user experience of terminal equipment, it is difficult for existing flat screens to meet the user's requirements. Therefore, concepts such as curved screens have emerged as the times require, such screens can achieve curved displays. However, due to various problems with the current screens, there are not many that can be produced in the market. [0003] The metal casing commonly used in the prior art is prone to signal interference to WIFI, NFC, and LIFI, while 3D glass or plastic cover can greatly improve the appearance and feel of the mobile phone. Therefore, at present, the metal casing is gradually changed to 3D glass when preparing the casing or a case made of plastic. At the same time, the invention...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/04C09D175/14C09D163/00
CPCC08J7/042C08J2463/00C08J2475/14C09D163/00C09D175/14
Inventor 金国华
Owner 浙江欣麟新材料技术有限公司