Edge exposure machine and edge exposure method

Abstract

The invention relates to an edge exposure machine and an edge exposure method. The edge exposure machine comprises a light source, vacuum pads, a light reflecting bottom plate and a translation mechanism. The light source is used for exposing a substrate edge from the upper side of a substrate; the vacuum pads are used for fixing the substrate from the lower side of the substrate by means of vacuum absorption and upwardly supporting the substrate; the light reflecting bottom plate is positioned at the bottom of a chamber of the edge exposure machine and is used for reflecting downward light rays on the lower side of the substrate, the light rays are emitted by the light source, and a light reflecting range can be generated by the light reflecting bottom plate and corresponds to portions ofthe substrate edge when the substrate edge is exposed by the edge exposure machine; the translation mechanism is used for adjusting the horizontal relative locations of the substrate edge and the vacuum pads adjacent to the substrate edge, so that the vacuum pads adjacent to the substrate edge can tend to get away from the reflecting range. The edge exposure machine and the edge exposure method have the advantages that influence of the light intensity of reflected light rays on substrate irradiation can be reduced, the problem of uneven brightness of existing vacuum pads can be effectively solved, and loss of the yield can be reduced.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an edge exposure machine and an edge exposure method. Background technique [0002] In the manufacturing process of LCD display panels and OLED display panels, the photolithography process is often used: specifically, a mask plate is placed on the substrate coated with photoresist, and then the substrate is exposed by an exposure machine. The mercury lamp emits ultraviolet light to transfer the image information on the mask plate to the surface of the substrate coated with photoresist. Based on the pattern of the mask plate, the photoresist will have exposed parts and unexposed parts; Developing the photoresist can remove the exposed part of the photoresist and keep the unexposed part of the photoresist, or remove the unexposed part of the photoresist and keep the exposed part of the photoresist, so that The photoresist forms the desired pattern; finally, it is etched to form t...

AI Technical Summary

Problems solved by technology

When the vacuum pad 2 is in the reflection range, the vacuum pad 2 at the edge of the substrate 1 blocks the light reflected from below, and the photosensitive part and the light-shielding part around the vacuum pad 2 form a sharp contrast, resulting in the corresponding light-shielding of the vacuum pad 2 Some critical dimensions (CD) have an obvious trend of change, which leads to the generation of square-shaped unevenness of light and dark (Mura)

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