Tweezers for clamping substrate in clean room

Abstract

The invention discloses tweezers for clamping a substrate in a clean room. The tweezers comprise a fixing arm. A first clamping plate is connected to the lower end of the fixing arm. A first rubber strip is connected to the edge of the tail end of the first clamping plate. The upper part of the fixing arm is connected with a first guide post and a second guide post of the fixing arm, wherein the first guide post and the second guide post are parallel to each other and perpendicular to the fixing arm, the first guide post and the second guide post are connected with a movable arm, a second clamping plate is connected to the lower end of the movable arm, and a second rubber strip is connected to the edge of the tail end of the second clamping plate. A first spring is connected to the outer ring of the first guide post, and a second spring is connected to the outer ring of the second guide post. A first fixing block is connected to the tail end, close to the movable arm, of the first guide post, and a second fixing block is connected to the tail end, close to the movable arm, of the second guide post. The tweezers have the beneficial effects that the tweezers do not need to be replaced when clamping the side edges of substrates with the large changes in size, and the edge collapse and pollution to the surfaces of the substrates do not occur.

Description

technical field [0001] The invention relates to a tweezers used for clamping substrates in a clean room. Background technique [0002] Tweezers are often used to hold the substrate when developing microelectronic devices, MEMS devices, etc. in a clean room. At present, the tweezers used for clamping the substrate in the clean room clamp the substrate by the rotational movement of the tweezers arm. The clamping methods include clamping the upper and lower surfaces of the substrate and clamping the side of the substrate. The method of clamping the upper and lower surfaces of the substrate, because the angle between the two clamping arms is small, the substrates of different sizes can be firmly clamped, but the direct contact between the tweezers and the upper surface of the substrate is easy to cause contamination or contamination of the substrate surface. scratched. The method of clamping the side of the substrate can prevent the surface of the substrate from being polluted...

AI Technical Summary

Problems solved by technology

The method of clamping the upper and lower surfaces of the substrate, because the angle between the two clamping arms is small, the substrates of different sizes can be firmly clamped, but the direct contact between the tweezers and the upper surface of the substrate is easy to cause contamination or contamination of the substrate surface. scratch

The method of clamping the side of the substrate can prevent the surface of the substrate from being polluted or scratched by direct contact with the tweezers, but there are two problems: on the one hand, for substrates with large size differences, it is necessary to replace tweezers of different sizes, Otherwise, the angle between the two clamping arms is too large, and the contact area between the tweezers arm and the side of the substrate is small, causing the substrate to slip; When it is large, it will still cause a large local stress on the sharp edge of the substrate side and cause substrate chipping, and the debris generated by the substrate chipping will contaminate the upper surface of the substrate

Therefore, the existing tweezers for clamping substrates in the clean room have the problems of chipping and contaminating the surface of the substrate when the tweezers need to be replaced when clamping the side of the substrate with a large size change.

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