Heat dissipating device for active component

Abstract

The invention discloses a heat dissipating device for an active component. The device comprises a protecting box, wherein a separating plate is arranged in the protecting box and is used for separating the protecting box into a storing chamber and a cavity; two limiting plates which are parallel to each other are fixed into the cavity; a connecting plate is fixed between the two limiting plates; arotating rod is rotatably connected to the inner bottom part of the cavity, and the two limiting plates are correspondingly positioned on two sides of the rotating rod; the upper end of the rotatingrod passes through the sidewall of the connecting plate and extends to the upper end of the connecting plate; a rotating wheel is fixed to the upper end of the rotating rod; and a first tapered gear is fixed to the rotating rod. With the adoption of the device, the heat dissipating range can be adjusted while the heat of the active component is dissipated, so that the problem that only componentsin special areas are heat dissipated due to fixed position, and other components are damaged due to excessively high temperature can be solved; and moreover, the device is convenient to mount and dismount, simple to operate, and convenient to use.

Description

technical field [0001] The invention relates to the technical field of active devices, in particular to a heat dissipation device for active devices. Background technique [0002] If an electronic component has a power source inside it when it is working, the device is called an active device. This is an electronic component that requires a source of energy to perform its specific function. In terms of physical structure, circuit function and engineering parameters, active devices can be divided into two categories: discrete devices and integrated circuits. Simply speaking, they are devices that require energy. It will generate heat, which requires a device for dissipating heat from active devices. However, the existing heat sinks can only be fixed in one position for heat dissipation. Overheating will cause damage to the device. Therefore, we propose a heat dissipation device for active devices to solve the above problems. Contents of the invention [0003] The object ...

AI Technical Summary

Problems solved by technology

In terms of physical structure, circuit function and engineering parameters, active devices can be divided into two categories: discrete devices and integrated circuits. Simply speaking, they are devices that require energy. It will generate heat, which requires a device for dissipating heat from active devices. However, the existing heat dissipation devices can only be fixed at one position for heat dissipation. cause overheating and cause damage to the device, for this reason, we propose a cooling device for active devices to solve the above problems

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