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Cutting platform

A cutting platform and platform technology, applied in the field of mechanical processing, can solve problems such as low work efficiency and danger, and achieve the effects of ensuring smoothness, improving work efficiency, and fast unloading methods

Pending Publication Date: 2018-08-28
天津泰格瑞祥仪器设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In view of this, the present invention proposes a cutting platform, which aims to solve the problems of low work efficiency and danger caused by cutting with a sawtooth cutting platform

Method used

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Embodiment Construction

[0023] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and examples.

[0024] see figure 1 , the figure shows the preferred structure of the cutting platform provided by this embodiment. As shown in the figure, the platform inc...

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Abstract

The invention provides a cutting platform. The cutting platform comprises a first area platform and a second area platform, wherein the second area platform can be opened and closed; the first area platform is provided with hollow structures in the shapes matched with the pre-cutting shapes of samples so that the cut samples placed on the first area platform can be dropped from the corresponding hollow structures; and the second area platform is arranged in front of the first area platform, and the second area platform is used for tilting and unloading the blank samples on the second area platform when the second area platform is in an opened state, and storing the blank samples when the second area platform is in a closed state so as to convey the blank samples to the first area platform.According to the cutting platform, the second area platform achieves the purposes of automatic sample unloading and sample storage, so that the problem of dangers caused by manual operation is avoided; the first area platform is provided with the hollow structures in the shapes matched with the pre-cutting shapes of the samples so that the samples can be conveniently collected; and the surface ofthe first area platform is flat, a non-metal material is adopted as a surface lining board so that the blank samples can be prevented from being scratched, and the smoothness of the surfaces of the samples is guaranteed.

Description

technical field [0001] The invention relates to the technical field of mechanical processing, in particular to a cutting platform. Background technique [0002] Cutting technology is a very common processing technology in mechanical processing. It mainly cuts the entire blank sample into the required shape. There are mainly laser cutting, wire electric discharge cutting, water jet cutting and other methods. It is widely used due to the advantages of good quality and high efficiency. Traditional laser cutting machines are widely used in downstream applications of steel plate products such as automobile manufacturers and home appliance manufacturers. However, for the quality inspection of steel products, the laser cutting process has not been widely used, because when inspecting the quality of steel products, the requirements for sample preparation are relatively strict, including size, thermal influence, and surface quality. The existing laser cutting platform is a sawtooth...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/70B23K26/38
CPCB23K26/38B23K26/702
Inventor 刘波董强董永强刘俊峰黄建超王秀旗谷峰魏建辉
Owner 天津泰格瑞祥仪器设备有限公司
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