A high-performance control chip packaging structure
A technology for controlling the chip and packaging structure, applied in the direction of semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of easy breakage of pins and poor heat dissipation effect, and achieves improved heat dissipation efficiency, improved efficiency, and novel design. Effect
Active Publication Date: 2019-11-15
江苏感测通电子科技有限公司
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Problems solved by technology
[0004] The purpose of the present invention is to solve the shortcomings of the traditional packaging structure pins in the prior art that are easy to break and the heat dissipation effect is poor, and propose a high-performance control chip packaging structure
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[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.
[0024] refer to figure 1 with 2 , a high-performance control chip packaging structure, including an upper cover 1 and a lower casing 2, the upper cover 1 and the lower casing 2 are butted and sealed with each other to form a packaging shell, the inside of the packaging shell is provided with a substrate 3, and the substrate 3 is fixedly installed There is an integrated circuit bare chip 4, a layer of heat dissipation material 18 is laid on the side of the substrate 3 in contact with the integrated circuit bare chip 4, a number of short pins 5 are fixedly arranged on both sides of the package shell along its length direction, and the integrated circuit bare chip 4 Th...
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The invention discloses a high-performance control chip package structure, which comprises an upper cover and a lower shell, wherein the upper cover and the lower shell are mutually butted and sealedto form a packaging housing; a substrate is arranged in the packaging housing and is fixedly provided with an integrated circuit die; a plurality of short pins are fixedly arranged at two sides of thepackaging housing along the length direction; a metal contact on the integrated circuit die is connected with the short pins through a metal lead in a welding manner; resin is embedded into an innercavity of the packaging housing; a gap is reserved between the resin and the top of the upper cover; and the upper cover is provided with a heat dissipation structure in the gap. The high-performancecontrol chip package structure is novel in design, simple in structure and convenient to use; through the separate design of an external pin and a chip, the condition that the pins are not broken offin the transport process can be ensured, the pins can also be replaced, the utilization rate of the chip is improved, the scrap rate is reduced, meanwhile, the heat dissipation efficiency of the chipis improved while the airtightness is ensured, and the high-performance control chip package structure is suitable for popularization and application.
Description
technical field [0001] The invention relates to the technical field of chip packaging, in particular to a high-performance control chip packaging structure. Background technique [0002] Packaging refers to connecting the circuit pins on the silicon chip to the external joints with wires, so as to facilitate the connection of other devices. Package form refers to the housing used to install semiconductor integrated circuit chips. It not only plays the role of installing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also connects the contacts on the chip to the pins of the package shell with wires, and these pins pass through the wires on the printed circuit board. Connect with other devices to realize the connection between the internal chip and the external circuit. Because the chip must be isolated from the outside world to prevent impurities in the air from corroding the chip circuit and causing electrical performance degradatio...
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IPC IPC(8): H01L23/367H01L23/31H01L23/48
CPCH01L23/3107H01L23/367H01L23/48
Inventor 金祺青
Owner 江苏感测通电子科技有限公司