Anode material for electroplating and its preparation method and application

A technology of anode material and copper plating, applied in the direction of electrode, printed circuit manufacturing, printed circuit, etc., can solve the problems of decreased utilization rate of anode materials, neglect of disadvantages, increase of anode slime, etc.

Active Publication Date: 2019-12-10
GUANGDONG GUANGHUA SCI TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the actual production process, people only pay attention to the benefits of soluble phosphor copper anode to the electroplating industry, while ignoring its disadvantages in the application process
After a long period of acid copper electroplating practice, it was found that a large amount of incompletely reacted copper particles and copper slag were still wrapped in the anode slime, resulting in an increase in the anode slime and a decrease in the utilization rate of the anode material, thereby reducing the electrochemical oxidation efficiency of copper and phosphorus Copper Anode Utilization Rate
Therefore, solving the low utilization rate of soluble anodes, increasing anode slime, and improving the coating performance are the subjects of continuous research in the industry

Method used

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  • Anode material for electroplating and its preparation method and application

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Embodiment 1

[0028] This embodiment provides an anode material for electroplating and a preparation method thereof, comprising the following steps:

[0029] Step 1: Melting copper and phosphorus by smelting method to obtain phosphor copper melt. Among them, the content of copper is 99.97%, and the content of phosphorus is 0.03%;

[0030] Graphene is added to the phosphorus copper melt at a mass ratio of 1:200000, and dispersed uniformly to obtain a mixed melt; wherein, the particle size of graphene is 50 μm;

[0031] The mixed melt was kept at 1200°C for 30 minutes, and then poured into a mold to obtain an ingot. The ingot was forged and rolled several times at room temperature to obtain an anode material.

[0032] Step 2: Place the above-mentioned anode material in a titanium basket as the anode, and use the PCB board as the cathode, and place it in the copper plating solution. The copper plating solution consists of 240g / L copper sulfate, 50g / L sulfuric acid, 5g / L Guangdong Dongshuo Te...

Embodiment 2

[0035] This embodiment provides an anode material for electroplating and a preparation method thereof, comprising the following steps:

[0036] Step 1: Melting copper and phosphorus by smelting method to obtain phosphor copper melt. Among them, the content of copper is 99.95%, and the content of phosphorus is 0.05%.

[0037] Add activated carbon to the phosphor copper melt at a mass ratio of 1:100000, and disperse evenly to obtain a mixed melt; wherein, the particle size of the activated carbon is 20 μm;

[0038] The mixed melt was kept at 1200°C for 30 minutes, and then poured into a mold to obtain an ingot. The ingot was forged and rolled several times at room temperature to obtain an anode material.

[0039] Step 2: Place the above-mentioned anode material in a titanium basket as the anode, and use the PCB board as the cathode, and place it in the copper plating solution. The copper plating solution consists of 240g / L copper sulfate, 50g / L sulfuric acid, 5g / L Guangdong Do...

Embodiment 3

[0042] This embodiment provides an anode material for electroplating and a preparation method thereof, comprising the following steps:

[0043] Step 1: Melting copper and phosphorus by smelting method to obtain phosphor copper melt. Among them, the content of copper is 99.96%, and the content of phosphorus is 0.04%;

[0044] Add carbon nanotubes to the phosphorus copper melt at a mass ratio of 1:300000, and disperse evenly to obtain a mixed melt; wherein, the average diameter of the carbon nanotubes is about 100 nm, and the average length of the tubes is about 80 μm;

[0045] The mixed melt was kept at 1200°C for 30 minutes, and then poured into a mold to obtain an ingot. The ingot was forged and rolled several times at room temperature to obtain an anode material.

[0046]Step 2: Place the above-mentioned anode material in a titanium basket as the anode, and use the PCB board as the cathode, and place it in the copper plating solution. The copper plating solution consists of...

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Abstract

The invention relates to an anode material for electroplating and a preparation method and application thereof. The anode material for electroplating is composed of copper, phosphorus and carbon. Theanode material for electroplating is prepared by mechanically doping a phosphorus-copper alloy with conductive simple substance carbon, therefore, the electrochemical oxidation efficiency of copper can be effectively improved, and the utilization rate of the anode material can be effectively increased.

Description

technical field [0001] The invention relates to the field of electroplating, in particular to an anode material for electroplating, a preparation method and application thereof. Background technique [0002] The early electroplating process mainly used pure copper as the anode of the electroplating system to supplement Cu in the plating solution. 2+ loss, but the acidity in the plating solution is relatively high, and the pure copper and the acid in the plating solution will react continuously under the action of dissolved oxygen, resulting in Cu in the plating solution 2+ Elevated, H + The concentration drops, affecting the performance of the plating solution. In addition, Cu in the bath 2+ It can also produce a small amount of Cu with Cu + , Copper powder is formed in the plating solution, which will contaminate the electroplated object and lead to a decrease in the quality of the cathode coating, for example: causing problems such as rough surface of the plated plate,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D17/10C25D3/38C22C1/02C22C9/00H05K3/18
CPCC22C1/02C22C9/00C25D3/38C25D17/10H05K3/188
Inventor 熊艳平王翀程东向梁坤程骄何为肖定军
Owner GUANGDONG GUANGHUA SCI TECH
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