Carrying device

Abstract

The invention discloses a carrying device. The carrying device comprises a machine table, a plurality of positioning units and clamping units. The machine table is used for bearing workpieces. The positioning units comprise positioning execution parts and telescopic mechanisms; the positioning execution parts are connected with the machine table; the telescopic mechanisms can be switched between the free state that extending and retracting can be conducted freely and the self-locking state that extending and retracting are limited under the effect of an electric field of an electromagnetic field; the telescopic mechanisms and the positioning execution parts are rotatably connected so as to lock the positioning execution parts inthe self-locking state; and the clamping units are suitable for clamping the workpieces. Thus, the workpieces are supported and positioned through the carrying device, the positioning units generates certain displacement along with placing of the workpieces so as to guarantee that the workpieces and the positioning units are always kept to be attached, and then the workpieces are clamped with the assistance of the clamping units. In the workpiece carrying process, the workpieces arerapidly and precisely positioned by the positioning units and the clamping units, so that shaking and damage of the workpieces in the transfer process are effectively avoided.After the workpieces reach the next station, the positioning units can be controlled to be rapidly unlocked, and convenience and rapidness are achieved.

Description

technical field [0001] The invention relates to the technical field of semiconductor material handling, in particular to a handling device. Background technique [0002] In the related art, the positioning method of the semiconductor workpiece on the handling device: two cylindrical plastic blocks are respectively fixed at the four corners of the machine platform of the handling device as the limit device; after the position of the semiconductor workpiece is determined, the bottom of the semiconductor workpiece The distance between the edge and the limiting device is about 3mm. [0003] The traditional positioning method of this semiconductor workpiece has the following disadvantages: 1) low positioning accuracy; 2) the semiconductor workpiece and the limit device can move relatively; 3) the vibration of the semiconductor workpiece is relatively large during the movement of the handling device; 4) when the semiconductor workpiece is picked and placed It is easy to rub again...

AI Technical Summary

Problems solved by technology

[0003] The traditional positioning method of this semiconductor workpiece has the following disadvantages: 1) the positioning accuracy is low; 2) the semiconductor workpiece and the limit device can move relatively; 3) the vibration of the semiconductor workpiece is relatively large during the movement of the handling device; 4) when the semiconductor workpiece is picked and placed It is easy to rub against the limit device, resulting in friction loss; 5) The semiconductor workpiece is prone to large vibration during the pick-and-place process

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