A chip semiconductor packaging device

A packaging device, semiconductor technology, applied in the direction of semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of difficult placement, troublesome installation, etc., to achieve the effect of ensuring accuracy
CN108538759BActive Publication Date: 2019-04-05广东协铖微电子科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
广东协铖微电子科技有限公司
Publication Date
2019-04-05

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Abstract

The invention discloses a novel slice type semiconductor ultra-thin packaging device comprising a fixed base. A conveying assembly line extending left and right is arranged in the middle of the upperend surface of the fixed base. Sealing space is formed in the left side inside a fixed case; a hydraulic rod is fixedly connected to the central position of the lower end surface of a sealing plate; the lower end of the hydraulic rod passes through the lower end wall of the sealing space and is fixedly connected with a press-fit plate; a resin conveying device is arranged right below the press-fitplate and includes a winding mechanism and a pulling mechanism. When the packaging device is working, an extruding plate moves up and down along a guiding rod without falling based on cooperation ofan annular clamp plate and an annular clamp slot; the extruding plate can fall to be in contact with the lower end wall of glue storage space to prevent plugging of a glue coating needle due to solidification of lower-end glue liquid not in use for long time; and the resin sheet that is not used can be switched automatically, so that precision is improved and the work efficiency is enhanced.
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Description

technical field

[0001] The invention relates to the field of semiconductor packaging, in particular to a chip-type semiconductor packaging device. Background technique

[0002] At present, with the advancement of science and technology, people are increasingly pursuing low-cost, high-efficiency small-volume packaging in the production of chips in the electronics industry. As a very suitable packaging material, resin film has gradually entered people's field of vision. Compared with traditional The plastic sealing film used in the process, the resin film can also be packaged in an ultra-thin state, which greatly reduces the occupied space, but the ultra-thin volume also makes the installation troublesome and difficult for workers to install in the process of gluing and pressing. question. Contents of the invention

[0003] The object of the present invention is to provide a chip type semiconductor packaging device to solve the problems raised in the background art above. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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