Unlock instant, AI-driven research and patent intelligence for your innovation.

Method for fixing chip on textile

A fixing method and textile technology, applied in the field of smart wearables, can solve problems such as chip welding is easy to fall off

Active Publication Date: 2018-09-28
SHENZHEN RENBEN FASHION CO LTD
View PDF8 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a method for fixing chips on textiles, so as to solve the problem that the soldering connection of chips on textiles is easy to fall off in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for fixing chip on textile
  • Method for fixing chip on textile
  • Method for fixing chip on textile

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0037] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0038] In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indic...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method for fixing chip on textile. The method comprises steps as follows: the textile is clamped and fixed by two clamps; the two clamps are mounted in a synchronous feeding device of a quilting machine and connected with two push structures respectively; a chip provided with connecting plates at pin ends is provided and placed on the textile; conducting fiber is sewn on the textile, so that the conducting fiber wraps each connecting plate and form electrical connecting points respectively, and accordingly, the connecting plates are fixed on the textile. The chip provided with the connecting plates at the pin ends is used, the connecting plates bulge out of two sides of a pin, the conducting fiber is sewn on the textile to form the electrical connecting points, theconnecting plate is fixed on the textile, the chip is further mounted on the textile without welding, and pulling and twisting of the textile during normal use can be borne.

Description

technical field [0001] The invention belongs to the technical field of smart wear, and more specifically relates to a method for fixing chips on textiles. Background technique [0002] Nowadays, various smart wearable products emerge in an endless stream, but most of them are embodied in the form of watches and bracelets. However, smart clothing products will become the mainstream direction of smart wearable products in the future. Electronic components need to be installed on the textiles of smart clothing products. IC (Integrated Circuit, English for Integrated Circuit, abbreviated as IC), sensors and other chips in the prior art are generally installed and fixed by welding. However, textile products need to be able to withstand pulling and rubbing within the normal range of clothing products , When the soldered chip is in use, it is easy to fall off, the service life is short, and the reliability is poor. Contents of the invention [0003] The object of the present i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): D05B3/00D05B11/00D05B33/00D05B29/00
CPCD05B3/00D05B11/00D05B29/00D05B33/00
Inventor 王金玲佟奇
Owner SHENZHEN RENBEN FASHION CO LTD