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Shoe pad composition, shoe pad structure and manufacturing method thereof

A manufacturing method and composition technology, applied in the field of breathable insole structure, capable of solving problems such as airtight insole structure

Inactive Publication Date: 2018-10-09
游振贤 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Another object of the present invention is to provide an insole structure, which does not contain an adhesive substance between a breathable structure layer and an elastic structure layer, and the elastic structure layer contains at least one perforation, so that the soles of the feet are formed The heat and sweat can be discharged through the perforation, which solves the problem of airtightness of the conventional insole structure

Method used

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  • Shoe pad composition, shoe pad structure and manufacturing method thereof
  • Shoe pad composition, shoe pad structure and manufacturing method thereof
  • Shoe pad composition, shoe pad structure and manufacturing method thereof

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Embodiment Construction

[0032] In order to make the structural features of the present invention and the achieved effects have a further understanding and recognition, preferred embodiments and detailed descriptions are specially used, which are described as follows:

[0033] This implementation case provides an insole composition, an insole structure, and a manufacturing method for an insole structure, which are based on conventional fabrics and elastic structural layers, and need to pass through substances with adhesive properties (such as: Viscose) are joined together, so that the fabric and the elastic structure layer are blocked by the adhesive material, causing the heat and sweat generated by the soles of the feet to be unable to be removed, thus causing discomfort or odor when the user walks in the shoes; for To solve the above-mentioned shortcoming of the prior art, the present embodiment then proposes an insole composition, an insole structure and a manufacturing method thereof, which will be...

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PUM

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Abstract

The invention provides a shoe pad composition, a shoe pad structure and a manufacturing method thereof. According to the shoe pad structure, because a ventilating structure layer and an elastic structure layer do not contain an adhesive substance and the elastic structure layer comprises at least one through hole, hot air and sweat generated from sole of a user are discharged from an area of the ventilating structure layer which corresponds with the through hole to a space formed by the through hole, thereby settling a problem of low penetrating performance in known rubber, plastic or foamed shoe pad structure.

Description

technical field [0001] The invention relates to an insole composition, an insole structure and a manufacturing method thereof, especially a breathable insole structure without an adhesive layer, which is manufactured by an in-mold injection method. Background technique [0002] There are many types of functional insoles, including air-cushioned insoles, arch-type insoles, pressure-relief insoles, and deodorant insoles. Regardless of the type of insole, most of the requirements are developed towards the characteristics of breathability, perspiration, and comfort. and improvements. [0003] The insole support structure made of plastic, rubber or foam can make the insole supportive and elastic, however, because the conventional technology needs to rely on glue or other types of adhesive substances to join the cloth to the support structure, thus The fabric and the supporting structure are blocked by the adhesive material, so that the heat and sweat generated by the user while ...

Claims

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Application Information

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IPC IPC(8): A43B17/00A43B17/08A43B17/02B29C44/12C08L9/06C08L91/00C08L23/08C08J9/12C08J9/14
CPCA43B17/006A43B17/02A43B17/08B29C44/12C08J9/0061C08J9/122C08J9/141C08J9/144C08J9/146C08J2203/06C08J2203/14C08J2203/142C08J2309/06C08J2391/00C08J2409/06C08J2423/08C08J2491/00
Inventor 游振贤江水城林宏祥
Owner 游振贤
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