Manufacturing method of printed circuit board and printed circuit board
A technology of printed circuit board and manufacturing method, which is applied in the direction of multi-layer circuit manufacturing and printed circuit components, etc., can solve the problems of difficult to guarantee the thickness uniformity of the dielectric layer, difficult to control the expansion and shrinkage of the sub-outer layer, and abnormal alignment. , to achieve the effect of ensuring the alignment between layers of the overall structure, improving the problem of large differences in expansion and contraction, and avoiding the occurrence of abnormalities
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[0031] In order to understand the above objects, features and advantages of the present invention more clearly, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments may be combined with each other in the case of no conflict.
[0032] Many specific details are set forth in the following description to facilitate a full understanding of the present invention. However, the present invention can also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific details disclosed below. Example limitations.
[0033] In an embodiment of the first aspect of the present invention, a method for manufacturing a printed circuit board is proposed, figure 2 A schematic flow chart of a method for manufacturing a pri...
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