Camera module, main board and mobile terminal

Abstract

The invention provides a camera module, a main board comprising the camera module, and a mobile terminal. The camera module comprises: a package substrate; at least one camera, wherein the camera is arranged on the package substrate, the package substrate comprises an outer edge portion, and the outer edge portion surrounds the periphery of the camera; and a board edge bonding pad, wherein the board edge bonding pad is arranged on the outer edge portion, and a photosensitive element in the camera is connected with the board edge bonding pad through a signal line. When the camera module provided by the invention is connected with the main board, no FPC or BTB connector needs to be provided, so that the occupation space and the production cost are greatly reduced, the installation is convenient, an error is unlikely to be generated, meanwhile, no connection part of soft and hard combination exists, in this way, the installation reliability of the whole camera module is high, meanwhile aplurality of cameras can be arranged on the package substrate at the same time, thereby greatly saving the space of the main board compared with the traditional structure in which one location is hollowed out for one camera.

Description

technical field [0001] The invention relates to a camera module, a main board containing the camera module and a mobile terminal. Background technique [0002] The camera is one of the standard configurations of mobile phones. Now there are more and more cameras installed in mobile phones, from the rear camera to the front and rear cameras, to the mainstream rear dual camera and front and rear dual cameras, and now there are even rear three cameras. The development trend of photography scheme. The camera is an optical device. Due to the problem of imaging distance, the camera device cannot be made thinner. Now, the development of mobile phones towards thinner and lighter requires the whole machine to be thinner. Therefore, the structure of the current mobile phone has the main board hollowed out to accommodate the camera. [0003] Since the main board has been hollowed out, the output pins of the camera cannot be directly welded on the main board. In order to solve this pr...

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Problems solved by technology

[0003] Since the main board has been hollowed out, the output pins of the camera cannot be directly welded on the main board. In order to solve this problem, in the prior art, a BTB (Board To Board, board-to-board) connector is often used to cooperate with the FPC. way to connect the camera and the motherboard, such as Figure 8 As shown, the output pin of the camera is soldered on one end of the FPC, the other end of the FPC is soldered on the BTB connector, and the BTB connector is connected to the motherboard

[0004] The above-mentioned connection method, because a camera needs a BTB connector, takes up a lot of space, which is not conducive to the thinning of the device; at the same time, the FPC and BTB connectors only play the role of signal transmission, but they need to occupy a considerable part of the cost. This leads to high equipment production costs; in addition, this connection method is complicated, and the lines between the cameras are easily connected incorrectly. At the same time, since the photosensitive device of the camera needs to be bonded to the substrate through a bonding wire, the substrate needs to be a hard package Substrate, which leads to the need for a soft-hard connection between the substrate of the photosensitive device and the FPC. This connection method has poor reliability and the joint is easy to tear

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