A kind of diamond grinding disc and its preparation process

A preparation process and diamond technology, which is applied in the direction of manufacturing tools, metal processing equipment, grinding/polishing equipment, etc., can solve the problems of diamond cutter head or grinding block continuous brazing type diamond grinding disc debris clogging processing efficiency and noise, etc. Achieve the effect of high binding force, high efficiency, and avoid inaccurate precision

Active Publication Date: 2020-11-06
SHANTOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a diamond grinding disc with chip removal and heat dissipation function and its preparation process, which can solve the problems caused by the offset and blockage of continuous brazing diamond grinding disc debris when existing welding or inlaying diamond cutter heads or grinding blocks. Problems such as processing efficiency and noise, as well as the efficiency and cost of existing mechanical grooves or laser ablation and etching grooves

Method used

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  • A kind of diamond grinding disc and its preparation process
  • A kind of diamond grinding disc and its preparation process
  • A kind of diamond grinding disc and its preparation process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Such as figure 2 As shown, a diamond grinding disc includes a grinding disc substrate 1 , diamond abrasive grains 2 , brazing material 3 , groove 4 , and a circular fixing hole 5 . A circular fixing hole 5 is arranged in the center of the grinding disc substrate 1 of the diamond grinding disc. The surface of the grinding disc base 1 is fixed with diamond abrasive grains 2 by brazing; the diamond particles 2 on the surface of the grinding disc base 1 are arranged geometrically and directionally by means of ultraviolet light curing; the working surface of the grinding disc base is provided with multiple grooves 4 with chip removal and heat dissipation functions .

[0022] The preparation process is as follows: weigh 100 g of thermoplastic resin adhesive and ethanol diluent according to the mass ratio of 5:1, mix well, apply the mixed solution evenly on the working surface of the grinding disc base 1, and let it stand for 15 minutes. Stick the treated grinding disc base...

Embodiment 2

[0024] Such as Figure 4 As shown, a diamond grinding disc includes a grinding disc substrate 1, diamond abrasive grains 2, a brazing material 3, a groove 4, and six symmetrical circular fixing holes 6. The surface of the disc substrate 1 is fixed with diamond abrasive grains 2 by brazing; the diamond particles on the surface of the disc substrate 1 are arranged geometrically and directionally by means of ultraviolet light curing, and the working surface of the disc substrate is provided with multiple grooves 4 with chip removal and heat dissipation functions.

[0025] The preparation process is as follows: Weigh 100g of thermoplastic resin adhesive and ethanol diluent according to the mass ratio of 6:1, mix thoroughly, apply the mixed solution evenly on the working surface of the grinding disc base 1, and let it stand for 20 minutes. Stick the treated grinding disc base 1 in the copper-based brazing material granules to form the copper-based brazing material 3 base layer; , ...

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Abstract

The invention relates to a diamond grinding disk and a preparation process thereof. The preparation process comprises the steps that a brazing material bonding layer with diamond abrasive particles isfirstly prepared on the work surface of a grinding disc base through an adhesive and photosensitive glue; exposure is carried out through ultraviolet beams according to a set arrangement pattern, thediamond particles on the portion irradiated by ultraviolet light are curved, the diamond abrasive particles not photocured and brazing material particles are cleaned and fall off through an organic solvent, and therefore geometric orientation arrangement of the diamond particles is achieved. The diamond particles are brazed on the base of the prepared diamond grinding disc; and the diamond particles form geometric orientation arrangement in an ultraviolet photocuring manner, and grooves with chip discharging and heat radiating functions are formed in the work surface of the grinding disc base. Compared with a traditional laser ablation technology, the efficiency is higher, and energy saving and environmental friendliness are achieved better.

Description

technical field [0001] The invention belongs to a diamond grinding disc, and in particular relates to a diamond grinding disc which is cured by ultraviolet light to form a geometric orientation arrangement and has the function of chip removal and heat dissipation and its preparation. Background technique [0002] Grinding discs are divided into diamond grinding discs, silicon carbide grinding discs, resin grinding discs and ceramic grinding discs according to different grinding materials. Among them, diamond grinding discs are a new type of disc grinding tool, which has the advantages of good wear resistance, high grinding efficiency and long service life. Therefore, it is widely used in the fields of polishing and other precision processing of surfaces such as jade, stone and glass products. However, the existing electroplated diamond grinding discs have low service life due to insufficient bonding force. Ordinary diamond grinding discs are unevenly distributed when welding...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D5/06B24D18/00B23K1/008
CPCB23K1/008B24D5/06B24D18/0054
Inventor 王双喜潘爱金陈鹏张瀚韬
Owner SHANTOU UNIV
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