Chip-type semiconductor ultrathin packaging device

A packaging device and semiconductor technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as difficult placement and troublesome installation, and achieve the effect of ensuring accuracy

Inactive Publication Date: 2018-10-23
岑森参
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  • Abstract
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  • Application Information

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Problems solved by technology

[0002] At present, with the advancement of science and technology, people are increasingly pursuing low-cost, high-efficiency small-volume packaging in the production of chips in the electronics industry. As a very suitable packaging material, resin film has gradually entered people's field of vision. Compared with traditional The plastic sealing film used in the process, the resin film can also be packaged in an ultra-thin state, which greatly reduces the occupied space, but the ultra-thin volume also makes the installation troublesome and difficult for workers to install in the process of gluing and pressing. question

Method used

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  • Chip-type semiconductor ultrathin packaging device
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Embodiment Construction

[0014] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0015] see Figure 1-6, an embodiment provided by the present invention: a chip-type semiconductor ultra-thin packaging device, including a fixed base 1, a conveying line 2 extending left and right is arranged at the middle position of the upper end surface of the fixed base 1, and the conveying line 2 A fixed conveying channel 3 is provided at the middle position of the upper end surface of the assembly line 2, and a conveying trolley 4 is installed in the fi...

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Abstract

The invention discloses a chip-type semiconductor ultrathin packaging device, and the device comprises a fixed substrate. The center of the upper end face of the fixed substrate is provided with a conveying assembly line which extends in a left-right direction. The left side of the interior of a fixed cabinet is provided with a closed space, and the center of the lower end face of the sealing plate is fixedly connected with a hydraulic rod. The lower end of the hydraulic rod passes through the lower end wall of the closed space and is fixedly connected with a pressing-fit board. A resin sheetconveying device is disposed exactly below the pressing-fit board, and comprises a winding mechanism and a pulling mechanism. In operation, the cooperation of an annular clamping board and an annularclamping groove can enable an extruding plate not to fall off when the extruding plate move up and down along a guide rod, and the extruding board can fall to make contact with the lower end wall of aglue storing space, thereby preventing the solidification of glue at lower end from causing the blocking of a glue coating needle after the glue is not used for a long time period. Meanwhile, resin sheets which are not used can be automatically switched, thereby improving the precision, and improving the work efficiency.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a chip-type semiconductor ultra-thin packaging device. Background technique [0002] At present, with the advancement of science and technology, people are increasingly pursuing low-cost, high-efficiency small-volume packaging in the production of chips in the electronics industry. As a very suitable packaging material, resin film has gradually entered people's field of vision. Compared with traditional The plastic sealing film used in the process, the resin film can also be packaged in an ultra-thin state, which greatly reduces the occupied space, but the ultra-thin volume also makes the installation troublesome and difficult for workers to install in the process of gluing and pressing. question. Contents of the invention [0003] The object of the present invention is to provide a chip-type semiconductor ultra-thin packaging device to solve the problems raised in the a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56
CPCH01L21/56
Inventor 岑森参
Owner 岑森参
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