Electronic equipment including antennas using conductive material in the housing of the electronic equipment

A technology for electronic equipment and conductive materials, which is applied to antenna equipment with additional functions, electrical short antennas, and devices that enable antennas to work in different frequency bands at the same time, and can solve problems such as unclaimed and undecided

Active Publication Date: 2021-09-21
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

No determination has been made, and no claim has been made, as to whether any of the above might be applicable as prior art with respect to the present disclosure

Method used

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  • Electronic equipment including antennas using conductive material in the housing of the electronic equipment
  • Electronic equipment including antennas using conductive material in the housing of the electronic equipment
  • Electronic equipment including antennas using conductive material in the housing of the electronic equipment

Examples

Experimental program
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Embodiment Construction

[0028] The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of various embodiments of the present disclosure as defined by the claims and their equivalents. It includes various specific details to aid in that understanding but these are to be regarded as exemplary only. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the various embodiments described herein can be made without departing from the scope and spirit of the disclosure. In addition, descriptions of well-known functions and constructions may be omitted for clarity and conciseness.

[0029] The terms and words used in the following description and claims are not limited to the bibliographical meanings, but, are merely used by the inventor to enable a clear and consistent understanding of the present disclosure. Accordingly, it should be apparent to those skilled in the art that the followin...

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PUM

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Abstract

The present disclosure provides an electronic device. The electronic device includes a housing, a wireless communication circuit, a ground plane and a processor, the housing includes a first board, a second board and side members surrounding a space between the first board and the second board, the wireless communication circuit provides The first feed point is fed, and the ground plane is electrically coupled to the first ground point and the second ground point in the second board. The side member includes a first side, a second side, a third side and a fourth side. The first feed point is between the second side and the first ground point, the first feed point is closer to the second side than at least one first ground point is to the second side, and the second ground point is closer to the second side than the at least one first ground point. The two side surfaces are closer in distance to the second side surface than the first feeding point and the first grounding point, and are outside the area.

Description

technical field [0001] The present disclosure relates to antenna technology for utilizing metal housings included in electronic devices. Background technique [0002] Electronic devices such as smartphones, tablets, etc. can communicate with the network by using antennas. Currently, electronic devices use metal materials in housings for the purpose of increasing strength (or rigidity) and improving design. For example, an electronic device may use part of a metal case as an antenna. [0003] The above information is presented as background information only to facilitate an understanding of the present disclosure. No determination has been made, and no claim has been made, as to whether any of the above might be applicable as prior art with respect to the present disclosure. Contents of the invention [0004] In order to use the metal housing as an antenna, feeding points and ground points can additionally be realized in the metal housing. In addition, secondary process...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04M1/02H01Q1/44
CPCH01Q1/44H04M1/026H01Q9/0421H01Q5/328H01Q1/243H01Q1/48H04M1/0249H01Q1/24H01Q1/38H04M2250/06H04M2201/34H04M2250/22H01Q9/0407H01Q1/422
Inventor 姜京均金智虎薛炅文朴圭福李泫静张贵铉罗孝锡李昭英千载奉
Owner SAMSUNG ELECTRONICS CO LTD
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