Electronic circuit board lamination layer alignment mechanism
A technology for electronic circuit boards and pressing machines, which is applied in printed circuits, multilayer circuit manufacturing, printed circuit manufacturing, etc. The effect of registration accuracy
Active Publication Date: 2018-10-26
赣州联宇宏科技有限公司
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
In the prior art, when laminating multilayer circuit boards, the alignment between the boards is mostly not accurate enough, and misalignment between the boards is prone to occur, so that the circuit board after lamination has certain defects
Method used
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[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0019] In describing the present invention, it should be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientations or positional relationships indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention, rather than indicating or...
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The invention discloses an electronic circuit board lamination layer alignment mechanism comprising a laminating machine body. A motor is installed on the upper end of the internal side surface of thecavity. The rotating shaft of the motor is fixedly connected with first worm rods. The other end of each first worm rod is connected in the cavity through a bearing. The first worm rods are engaged on the surface of first worm gears. Thread cylinders are connected on the surface of first threaded rods through threads. A push plate is fixedly connected on the lower end of the thread cylinders. Supporting columns are fixedly connected on the lower surface of the push plate. Through slots are arranged on the lower end of the internal side of the cavity. The supporting columns are slidably sleeved in the through slots. Rollers are rotatably connected on the lower ends of the supporting columns through rotating shafts. According to the electronic circuit board lamination layer alignment mechanism, positioning is performed through the light emitted by the infrared laser lamp so as to ensure the alignment accuracy between multiple boards and avoid the situation of dislocation of multiple boards.
Description
technical field [0001] The invention relates to the technical field of electronic circuit boards, in particular to a laminate alignment mechanism for electronic circuit boards. Background technique [0002] The production method of multi-layer circuit boards is generally to make the inner layer graphics first, and then make a single-sided or double-sided substrate by printing and etching, and put it into the specified layer, and then heat, press and bond it. [0003] At present, most of the existing multilayer circuit boards are laminated by laminating machines. In the prior art, when laminating multilayer circuit boards, the alignment between the boards is mostly not accurate enough, and misalignment between the boards is prone to occur, so that the circuit board after lamination has certain defects. Contents of the invention [0004] The object of the present invention is to provide a lamination alignment mechanism for electronic circuit boards, so as to solve the probl...
Claims
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IPC IPC(8): H05K3/46
CPCH05K3/4638H05K2203/166
Inventor 唐庆联
Owner 赣州联宇宏科技有限公司