Double-cooling structure dust-free computer case

Abstract

The invention discloses a double-cooling structure dust-free computer case. The computer case comprises a case shell; a micro air conditioner cooling device is arranged in the case shell; the micro air conditioner cooling device comprises a micro air conditioner internal unit fixed in the case shell and a micro air conditioner external unit fixed outside the case shell; the micro air conditioner internal unit is connected with the micro air conditioner external unit through a connection pipeline; and a dustproof fan cooling device is arranged at the inner rear end of the case shell. Both the micro air conditioner internal unit and the micro air conditioner external unit are arranged in the case shell, so that computers can have a double-cooling function, the cooling efficiency is high andthe cooling effect is good; when the cooling fan is not applicable for cooling, an air inlet is covered through a dustproof plate, so that the dust is prevented from entering into the case to influence the computer components, and then the service life of the components is prolonged.

Description

technical field [0001] The invention belongs to the technical field of computers, and in particular relates to a dust-free computer case with double heat dissipation structures. Background technique [0002] A large number of integrated circuits are used in computer components. High temperature is the enemy of integrated circuits. High temperature will not only lead to unstable operation of the system, shorten the service life, and may even burn some components. The heat that causes high temperature does not come from outside the computer, but from inside the computer, or inside the integrated circuit. The function of the radiator is to absorb the heat and then dissipate it inside or outside the case to ensure that the temperature of the computer components is normal. Existing computer heat dissipation is generally through contact with the surface of the heating component, absorbing heat, and then transferring the heat to a distant place through various methods, such as the...

AI Technical Summary

Problems solved by technology

Existing computer heat dissipation is generally through contact with the surface of the heating component, absorbing heat, and then transferring the heat to a distant place through various methods, such as the air in the chassis, and then the chassis passes the hot air to the outside of the chassis through the fan. Complete the heat dissipation of the computer. The existing heat dissipation effect is average. When the running volume is large, instability will occur, which will affect the service life of the computer host. However, the existing heat dissipation method needs to leave an open air outlet on the chassis , can not prevent dust from entering the inside of the chassis, and dust collection for a long time will have a considerable impact on the service life of the components in the chassis

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