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Cutting method

A cutting method and cutting path technology, which are applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of increased scrap rate of packaging unit 1a, low accuracy of manual cutting, and high scrap rate of packaging unit 1a, and reduce the The effect of scrap rate

Active Publication Date: 2018-11-02
SILICONWARE PRECISION IND CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the existing packaging process, since the packaging substrate 10 is glued on the adhesive tape 1c and pre-baked, there will be deviation (such as Figure 1C shown), so during the singulation operation, the linear cutting path S will cause the cutting knife to damage the packaging unit 1a (such as Figure 1C shown), resulting in an increase in the scrap rate of the packaging unit 1a
[0005] In addition, if the cutting machine is replaced by manual cutting, the scrap rate of the packaging unit 1a will be higher because of the lower accuracy of manual cutting.

Method used

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Embodiment Construction

[0046] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0047] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "above" and "a" quoted in this ...

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Abstract

A cutting method is used for carrying out at least one transverse and longitudinal cutting operation on a bearing structure provided with a plurality of packaging units, so as to separate the packaging units, and the overall cutting path of at least one transverse or longitudinal cutting operation is a non-single straight line, so that the cutting path can avoid the packaging unit according to requirements, and damage caused by the fact that the cutting tool touches the packaging unit is avoided.

Description

technical field [0001] The invention relates to a packaging process, in particular to a packaging singulation method. Background technique [0002] With the development of the electronic industry, today's electronic products have tended to be designed in the direction of thinner, smaller and more functional, and semiconductor packaging technology has also developed different packaging types. Among them, Ball grid array (BGA for short) ), such as PBGA, EBGA, FCBGA, etc., is an advanced semiconductor packaging technology, which uses a packaging substrate to place semiconductor components, and plants a plurality of solder balls arranged in a grid array on the back of the packaging substrate, so that the same unit A circuit board with a larger area can accommodate more input / output terminals to meet the requirements of highly integrated semiconductor chips, and the entire packaging unit is soldered and electrically connected to external electronic devices by means of these solde...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/304H01L21/78
CPCH01L21/3043H01L21/78
Inventor 杨泰嘉詹原旻方君维
Owner SILICONWARE PRECISION IND CO LTD