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A double ladder mobile antenna pcb and its manufacturing method

A technology of mobile antenna and manufacturing method, which is applied in the fields of printed circuit manufacturing, multi-layer circuit manufacturing, including printed electrical components, etc., can solve problems such as difficulty in manufacturing, and achieve the effects of improving product yield, avoiding interference, and avoiding damage

Active Publication Date: 2019-08-06
VICTORY GIANT TECH HUIZHOU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The receiving end of the antenna and part of the shielding layer need to be exposed on the board surface, so a double-step PCB design will be adopted, which will bring greater difficulty to PCB manufacturers.

Method used

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  • A double ladder mobile antenna pcb and its manufacturing method
  • A double ladder mobile antenna pcb and its manufacturing method

Examples

Experimental program
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Effect test

Embodiment Construction

[0020] The present invention will be described in detail below with reference to the accompanying drawings and embodiments.

[0021] like figure 1 , 2 The double-ladder mobile antenna PCB shown includes L1 layer 1 and L5 layer 5 printed with the outer layer antenna, L2 layer 2 and L4 layer 4 printed with the shielding layer, and L3 layer 3 printed with the inner layer antenna; L1 layer , L2 layer, L3 layer, L4 layer, and L5 layer are stacked sequentially from top to bottom, and a PP insulating layer 6 is provided between adjacent two layers; the receiving end of the corresponding inner layer antenna on the L3 layer is provided with a first exposed copper area 31 A second exposed copper area 22 is set above the first exposed copper area on the L2 layer, and the first exposed copper area and the second exposed copper area are all empty, respectively between the L1 layer and the L2 layer, between the L2 layer and the second exposed copper area. A stepped structure is formed bet...

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Abstract

Provided by the present invention is a double-step mobile antenna PCB, comprising an L1 layer and an L5 layer each printed with an outer-layer antenna, an L2 layer and an L4 layer each printed with a shielding layer, and an L3 layer printed with an inner-layer antenna. The L1 layer, the L2 layer, the L3 layer, the L4 layer and the L5 layer are successively laminated from top to bottom, and a step structure is respectively formed between the L1 layer and the L2 layer, and between the L2 layer and the L3 layer. Further provided is a manufacturing method for the double-step mobile antenna PCB, including L3 layer substrate cutting→L3 line producing→AOI→chemical gold plating / gold plating→ high-temperature adhesive tape pasting→laser tapping→first lamination→L2 / L4 line producing→AOI→L2 / L4 layer chemical gold plating / gold plating→high-temperature adhesive tape pasting→laser tapping→second lamination→drilling→L1 / L5 line producing→AOI→chemical gold plating / gold plating→forming→mechanical depth control gong→laser uncovering.

Description

technical field [0001] The invention relates to the field of PCB board production, in particular to a double-step mobile antenna PCB and a production method. Background technique [0002] With the rapid development of mobile communication technology, especially wireless communication technology, various terminal devices emerge as the times require. Antenna is an important part of mobile terminal equipment, and its characteristics directly determine the performance of the entire communication link system. At present, the satellite navigation market continues to expand in the civilian field, especially with the rapid development of the mobile Internet and the popularity of smart phones, which has laid a solid foundation for the outbreak of satellite positioning services. Signal confidentiality and anti-interference ability are the key factors to determine the quality of the antenna. [0003] One of the methods to solve the signal interference problem is to build the antenna ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/16H05K3/46
CPCH05K1/0218H05K1/0298H05K1/16H05K3/4644
Inventor 何艳球李成军施世坤赵启祥张亚锋
Owner VICTORY GIANT TECH HUIZHOU CO LTD