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Flexible circuit board, method for manufacturing flexible circuit board, and flexible display panel

A technology for flexible circuit boards and manufacturing methods, which is applied in the direction of circuit substrate materials, printed circuits, printed circuits, etc., and can solve the problems of high performance requirements and large bending radius of pasting adhesives

Active Publication Date: 2019-12-27
GUANGZHOU GOVISIONOX TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, since polyimide has a certain degree of bending resistance, when bending a planar flexible circuit board, there is a disadvantage that the bending radius is relatively large, and because the bent flexible circuit board has a certain rebound Stress, the requirements for the adhesive performance of the adhesive are relatively high

Method used

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  • Flexible circuit board, method for manufacturing flexible circuit board, and flexible display panel
  • Flexible circuit board, method for manufacturing flexible circuit board, and flexible display panel
  • Flexible circuit board, method for manufacturing flexible circuit board, and flexible display panel

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[0036] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0037] In the traditional technology, each layer structure of the flexible circuit board is a planar structure when it is tiled. Although each layer structure has a certain bending performance, there are problems of difficult bending and a large bending radius. If it is necessary to forcibly reduce the Its bending radius may also cause damage to the flexible circuit board. In addition, since the planar flexible circuit board has a certain internal stress when it is bent, there are also high requirements for the adhesive performance of the adhesive that maintains and fixes ...

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Abstract

The invention relates to a flexible circuit board, a flexible circuit board manufacturing method, and a flexible display panel. The flexible circuit board includes a substrate layer, a circuit conduction layer, and an insulation protection layer, wherein one side of the circuit conduction layer is attached to the substrate layer, and the other side of the circuit conduction layer is further adhered to the insulating protection layer; and the substrate layer, the circuit conduction layer and the insulating protection layer are in curved shape structures that are mutually compatible. Since the flexible circuit board has a curved shape structure, the flexible bending may be more easily realized, the bending radius may be reduced, and the rebound stress of the flexible circuit board may be reduced, so that the flexible circuit board has better bending performance, and is also capable of reducing the adhesive performance requirements of the adhesive during practical application, thereby achieving the purpose of reducing costs.

Description

technical field [0001] The present application relates to the technical field of display panels, in particular to a flexible circuit board, a method for manufacturing the flexible circuit board, and a flexible display panel. Background technique [0002] Flexible printed circuit board (FPC, Flexible Printed Circuit) is a flexible printed circuit board made of polyimide or polyester film as the base material, which has the characteristics of high wiring density, light weight and thin thickness. When using a flexible circuit board, there is a need to bend the flexible circuit board to adapt to the application scene. In the traditional technology, the flexible circuit board with a flat shape is mostly used for bending, and the bending is achieved by using adhesive glue. The purpose of pasting and fixing the flexible circuit board. [0003] However, since polyimide has a certain degree of bending resistance, when bending a planar flexible circuit board, there is a disadvantage ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/03
CPCH05K1/0271H05K1/028H05K1/0393H05K2201/09045
Inventor 熊水浒黄秀颀
Owner GUANGZHOU GOVISIONOX TECH CO LTD
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