a pcb circuit board
A PCB circuit board and substrate layer technology, applied in the direction of printed circuit components, etc., can solve the problems that the thickness of the PCB circuit board cannot be made very thick, the bending strength of the PCB circuit board is low, and the function of the PCB circuit board fails, etc., to achieve Conducive to normal use, increase the heat conduction column and heat dissipation layer, and the effect of reasonable structural design
Inactive Publication Date: 2019-09-10
深圳玛斯兰电路科技实业发展有限公司
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- Application Information
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Problems solved by technology
Due to material and performance limitations, the thickness of the PCB circuit board cannot be made very thick, and the bending strength of the PCB circuit board is low, which is prone to damage and deformation, which makes the function of the PCB circuit board invalid and affects the use.
Method used
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Embodiment Construction
[0020] The present invention will be further described below in conjunction with the accompanying drawings.
[0021] as attached Figure 1~6 , a kind of PCB circuit board: comprise substrate layer 2, metal plate 4 and heat dissipation layer 3; The material of metal plate 4 is copper; The material of described heat dissipation layer 3 is nano-carbon heat sink, and heat dissipation effect is good; Described substrate layer 2 A metal plate 4 is arranged between the heat dissipation layer 3; a connecting structure 6 is vertically arranged at both ends of the metal plate 4; the connecting structure 6 includes a first fixing structure 61 and a second fixing structure 62; the first fixing structure The structure 61 is arranged obliquely toward the substrate layer 2 and obliquely embedded in the substrate layer 2 ; the second fixing structure 62 is half-covered by the heat dissipation layer 3 . The connection structure 6 fixes the heat dissipation layer 3 and the substrate layer 2 to...
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The invention discloses a novel PCB, comprising a substrate layer, a metal plate and a heat dissipation layer, the metal plate is arranged between the substrate layer and the heat dissipation layer; connecting structures are vertically arranged at the two ends of the metal plate; each connecting structure comprises a first fixed structure and a second fixed structure; each first fixed structure isarranged in an inclined way towards the substrate layer and is embedded into the substrate layer in the inclined way; and each second fixed structure is coated with the heat dissipation layer. The metal plate is symmetrically provided with a plurality of reinforcement structures; the cross section of each reinforcement structure is in an inclined T shape; the heights of the reinforcement structures are sequentially reduced from the two ends of the metal plate to the middle; and the reinforcement structures are embedded into the substrate layer. The novel PCB is reasonable in structural design, bending resistance of the PCB is improved, and a heat conduction column and the heat dissipation layer are also added, so that heat above a conducting layer is transferred to a position below the PCB in a certain degree, and normal use of a component on the conducting layer is facilitated.
Description
technical field [0001] The invention relates to the field of PCB circuit boards, in particular to a PCB circuit board. Background technique [0002] PCB circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. Due to material and performance limitations, the thickness of the PCB circuit board cannot be made very thick. The bending strength of the PCB circuit board is low, and it is prone to damage and deformation, which makes the function of the PCB circuit board invalid and affects the use. Contents of the invention [0003] Purpose of the invention: In order to overcome the deficiencies in the prior art, the present invention provides a PCB circuit board, which greatly enhances the bending resistance of the PCB circuit board, and also plays a certain role in heat dissipation. [0004] Technical solution: In order to achieve the above p...
Claims
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IPC IPC(8): H05K1/02
Inventor 唐霞云
Owner 深圳玛斯兰电路科技实业发展有限公司