Semiconductor material production technical equipment
A production technology, semiconductor technology, applied in metal processing equipment, grinding/polishing equipment, grinding machines, etc., can solve the problems of cumbersome polishing operation steps, damage to the health of operators, debris splashing, etc., to achieve efficient polishing work, easy to operate , the effect of reducing the operation steps
Inactive Publication Date: 2018-11-13
广州粤晟科技有限公司
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Problems solved by technology
[0002] During the production and processing of semiconductor materials, the outer surface tends to be partially flat, and generally needs to be polished. The traditional polishing method is slow and inefficient. And the polishing operation steps are cumbersome, so it is urgent to develop a semiconductor material production technology equipment with good polishing effect, time-saving and labor-saving, and high work efficiency
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Embodiment Construction
[0015] Combine below Figure 1-4 The present invention will be described in detail.
[0016] refer to Figure 1-4 According to an embodiment of the present invention, a kind of semiconductor material production technology equipment includes a production main body 6, and a first sliding cavity 61 is provided inside the production main body 6, and the inner walls of the left and right sides of the first sliding cavity 61 are arranged symmetrically. There is a guide groove 64, and a second sliding cavity 62 is provided in the production body 6 on the lower side of the first sliding cavity 61, and the part between the first sliding cavity 61 and the second sliding cavity 62 A through cavity 66 is provided through it, and a transfer cavity 63 is provided in the production body 6 on the upper side of the first sliding cavity 61, and the part between the guide groove 64 on the left and right sides and the transfer cavity 63 rotates A first conical wheel 631 protruding into the tran...
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The invention discloses semiconductor material production technical equipment which comprises a production main body. A first sliding cavity is formed in the production main body; guiding grooves aresymmetrically formed in the inner walls of the left and right sides of the first sliding cavity; a second sliding cavity is formed in the position, on the lower side of the first sliding cavity, of the production main body; a through cavity is formed in the part between the first sliding cavity and the second sliding cavity in a penetrating mode; a delivering cavity is formed in the position, on the upper side of the first sliding cavity, of the production main body; first conical wheels stretching into the delivering cavity are connected into the parts between the guiding grooves in the leftand right sides and the delivering cavity in a rotating fit mode; second conical wheels which are arranged in a bilateral symmetry mode and connected with the first conical wheels on the left and right sides in a power fit mode are fixedly arranged on a steering shaft; and a mounting frame is connected into the first sliding cavity in a sliding fit mode, and a polishing device is arranged in the mounting frame.
Description
technical field [0001] The invention relates to the technical field of semiconductor material production, in particular to a semiconductor material production technical equipment. Background technique [0002] During the production and processing of semiconductor materials, the outer surface tends to be partially flat, and generally needs to be polished. The traditional polishing method is slow and inefficient. Moreover, the polishing operation steps are cumbersome, so it is urgent to develop a semiconductor material production technology equipment with good polishing effect, time-saving and labor-saving, and high work efficiency. Contents of the invention [0003] The object of the present invention is to provide a method for overcoming the above-mentioned defects in the prior art. [0004] A semiconductor material production technology equipment according to the present invention includes a production body, the production body is provided with a first sliding cavity ins...
Claims
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IPC IPC(8): B24B27/00B24B29/02B24B55/06B24B41/02B24B41/06B24B47/04
CPCB24B27/0015B24B29/02B24B41/02B24B41/06B24B47/04B24B55/06
Inventor 陆伟城
Owner 广州粤晟科技有限公司