Post exposure-baking device and optimization method for wafer line width

Abstract

The invention relates to a post exposure-baking device and relates to a manufacturing technology for an integrated circuit. The post exposure-baking device comprises a wafer, a hot plate and a heatingdevice, wherein the hot plate is located below the wafer and is used for heating the wafer; the heating device is located below the hot plate and is used for heating the hot plate; the heating devicecomprises a chassis and a plurality of thermal probes, wherein the plurality of thermal probes are arranged on the chassis and the temperatures of the plurality of the thermal probes are controllable, so that local temperature of the hot plate is adjustable, and further the line width on the wafer is adjusted to achieve higher lithography accuracy of the line width.

Description

technical field [0001] The invention relates to an integrated circuit manufacturing technology, in particular to a baking device. Background technique [0002] In the semiconductor process, the photolithography process is the process of transferring the pattern on the reticle to the wafer through a series of production steps. The general photolithography process has to go through the processes of coating primer on the wafer surface, spin coating photoresist, soft baking, alignment, exposure, post-exposure baking, development, hard baking, and detection. With the development of semiconductor technology, semiconductor technology nodes continue to shrink, and higher requirements are placed on the accuracy of lithography line width, which is also an important parameter in the lithography process. In the current production steps, there are many factors that lead to the problem of lithographic line width accuracy, among which the accuracy of the temperature of the hot plate durin...

AI Technical Summary

Problems solved by technology

like figure 1 As shown, the hot plate 200 includes seven heating modules (H0 to H6) to heat the hot plate to bake the exposed wafer 100, because the hot plate 200 only includes seven heating modules (H0 to H6), so It is impossible to accurately locally heat the hot plate 200, there are certain heating limitations, and it is impossible to flexibly control the local temperature of the hot plate 200, which affects the accuracy of the lithography line width

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