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Liquid cooling server equipment, server and liquid cooling device

A server, liquid cooling technology, applied in the direction of electrical equipment structural parts, instruments, cooling/ventilation/heating renovation, etc., can solve the problems of high price, limited application scenarios, hard disk failure and so on

Active Publication Date: 2018-11-13
BEIJING BAIDU NETCOM SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, for the immersion liquid cooling scheme, for ordinary mechanical hard disks (HDDs), due to the rotating parts inside, immersion in liquid will cause them to run abnormally and thus cannot be used; while helium-filled hard disks (He-HDDs) are better sealed , can be used in theory, but its sealing material has compatibility problems with the immersion liquid, and once it reacts in long-term operation, it will still cause hard disk failure; in addition, although solid-state drives (SSD) can be used, their capacity is lower than that of mechanical hard drives, and the price is relatively high. High, currently not a mainstream solution, resulting in limited application scenarios

Method used

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  • Liquid cooling server equipment, server and liquid cooling device
  • Liquid cooling server equipment, server and liquid cooling device
  • Liquid cooling server equipment, server and liquid cooling device

Examples

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Embodiment Construction

[0030] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. It should also be noted that, for the convenience of description, only the parts related to the related invention are shown in the drawings.

[0031] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and embodiments.

[0032] Please refer to figure 1 , figure 1 An exemplary structural diagram of an embodiment of a liquid-cooled server device according to an embodiment of the present application is shown.

[0033] Such as figure 1 As shown, the liquid-cooled server device 100 may include...

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Abstract

The embodiment of the invention discloses liquid cooling server equipment, a server and a liquid cooling device. The liquid cooling server equipment comprises at least one server, a liquid cooling device, a cooling component and a heat exchanger, wherein the server includes a framework, the lower portion of the framework is provided with a high-density energy-consuming device immersed in a coolingliquid, and the upper portion of the frame is provided with a low-density energy-consuming device above the cooling liquid; the liquid cooling device includes an immersion cabinet; the immersion cabinet includes a box body used for accommodating the cooling liquid and the at least one server, and a top cover detachably connected to the box body; the cooling component is arranged in the immersioncabinet, is located at a position above the cooling liquid and corresponding to the low-density energy-consuming device, and is configured to provide a cooling capacity for the low-density energy-consuming device; and the heat exchanger is arranged outside the immersion cabinet and is used for carrying out heat exchange on the cooling liquid in the immersion cabinet and a cooling medium in an external heat dissipation system. Through the equipment, the application range of an Immersion liquid cooling is widened.

Description

technical field [0001] The present application relates to the field of computer technology, in particular to the field of computer network technology, and in particular to liquid-cooled server equipment, servers and liquid-cooled devices. Background technique [0002] With the rise of big data and artificial intelligence, the computing needs of data centers are increasing day by day; at the same time, the development of server and chip technology, heterogeneous computing such as GPU, FPGA and ASIC, and the development of high-performance CPUs have made computing density more and more How to use lower energy consumption to solve the cooling of high-density energy consumption is very important. [0003] Among the existing solutions, immersion liquid cooling is the most effective means to solve the heat dissipation of high-power servers because it can completely solve the heat dissipation requirements of all components of the server and has the highest energy utilization effici...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G06F1/20
CPCG06F1/20H05K7/20781Y02D10/00
Inventor 井汤博李孝众张炳华
Owner BEIJING BAIDU NETCOM SCI & TECH CO LTD
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