Extrusion type conductive adhesive stirring box

Abstract

The invention puts forward an extrusion type conductive adhesive stirring box, which comprises a box body, an extrusion plate, a connecting shaft and a cylinder, wherein a plurality of barrels of a hollow structure are vertically installed in the box body; the bottom and the top of each barrel are respectively provided with a through hole; the extrusion plate is horizontally installed in the box body; a through hole is respectively formed in the extrusion plate by corresponding to each barrel; each barrel penetrates through the corresponding through hole; one end of the connecting shaft is connected with the output shaft of the cylinder, and the other end is connected with the extrusion plate; the cylinder is used for driving the extrusion plate to move back and forth along a length direction of each barrel. The extrusion plate is vertically moved to realize the vertical convection of conductive adhesive in the box body so as to continuously stir the conductive adhesive to avoid the conductive adhesive from coagulating; in addition, the conductive adhesive is stirred with a vertical convection method so as to be favorable for preventing the conductive adhesive from precipitating, and the equilibrium distribution of conductive modules in the conductive adhesive is guaranteed.

Description

technical field [0001] The invention relates to the technical field of conductive glue spraying, in particular to an extruded conductive glue mixing box. Background technique [0002] Conductive adhesive is an adhesive with certain conductive properties after curing or drying. It usually uses matrix resin and conductive fillers, namely conductive particles, as the main components. The conductive particles are combined through the bonding effect of the matrix resin to form a conductive adhesive. The path realizes the conductive connection of the adhered material. Since the matrix resin of the conductive adhesive is an adhesive, an appropriate curing temperature can be selected for bonding. At the same time, due to the miniaturization and miniaturization of electronic components and the rapid development of high density and high integration of printed circuit boards, and Conductive adhesives can be made into pastes to achieve very high line resolution. [0003] Since the con...

AI Technical Summary

Problems solved by technology

At present, only horizontal stirring is used in the stirring process of conductive adhesive, and up-and-down convective stirring cannot be realized, which leads to uneven distribution of conductive molecules inside the conductive adhesive, thus affecting the performance of the conductive adhesive.

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