Three-dimensional fractal prediction method of thermal contact resistance of bonding surface considering asperity substrate deformation
A technology of contact thermal resistance and prediction method, which is applied in geometric CAD, design optimization/simulation, calculation, etc., can solve the problems of not considering the influence of asperity matrix deformation, neglect, contact thermal resistance error, etc., to overcome the combination of calculation The effect of inaccurate surface contact thermal resistance and accurate prediction results
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[0062] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0063] A three-dimensional fractal prediction method for the contact thermal resistance of the joint surface considering the deformation of the asperity substrate, such as figure 1 shown, including the following steps:
[0064] Step 1. Simulate the three-dimensional profile of the asperity on the joint surface: replace the two-dimensional fractal function with a three-dimensional fractal function that is closer to the actual surface topography of the joint surface, and use the peak sum of the three-dimensional fractal function to calculate the contact deformation of the asperity The amplitude difference of the trough is represented by the following formula:
[0065] δ=2 ...
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