Silicon wafer wire-electrode cutting method

Abstract

The invention relates to a silicon wafer wire-electrode cutting method. The method comprises the steps that wiring is conducted from a wire releasing wheel to a take-up wheel, one part of a diamond wire on the take-up wheel is an old wire, and the other part is a new wire. Wiring is conducted from the take-up wheel to the wire releasing wheel, and a silicon block starts to be cut from the zero cutposition through the new wire. After new wire cutting is finished, the old wire on the take-up wheel performs reciprocating wiring between the wire releasing wheel and the take-up wheel, the siliconblock continues to move downwards, and the silicon block continues to be cut. When the height of the residual uncut part of the silicon block is h, a one-way wiring mode is adopted for cutting the residual silicon block until the diamond wire cut through the silicon block, wherein h is 1-5 mm. According to the silicon wafer cutting method, the new wire is adopted for cutting the silicon block fromthe zero cut position and cutting the residual silicon block in a one-way wire releasing mode in the final stage, and the yield of the silicon wafer is increased conveniently. In the middle section,the old wire is adopted for cutting the silicon block in a two-way wiring mode, and the wire is saved conveniently.

Description

technical field [0001] The invention relates to the field of silicon wafer wire cutting, in particular to a silicon wafer wire cutting method. Background technique [0002] At present, in the field of silicon wafer production, silicon blocks are generally cut into silicon wafers by wire cutting machines. The traditional cutting method is to first cut the silicon block from the zero cutting position with an old diamond wire. Due to the poor cutting ability of the old wire, the yield rate of silicon wafers cut by traditional methods is low. Contents of the invention [0003] Based on this, it is necessary to provide a wire cutting method for silicon wafers to solve the problem of low yield rate of silicon wafers cut by traditional methods. [0004] A silicon wafer wire cutting method, comprising: [0005] Route the wire from the pay-off reel to the take-up reel, so that part of the diamond wire on the take-up reel is the old wire and the other part is the new wire; run th...

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to provide a silicon wafer wire cutting method for the low yield rate of silicon wafers cut by traditional methods.

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