Circuit board and manufacturing method thereof
A manufacturing method and circuit board technology, applied in the directions of printed circuits, printed circuit components, electrical components, etc., can solve problems such as limiting the application of metal-based circuit boards, and achieve the effect of improving thermal conductivity
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Embodiment 1
[0018] Such as figure 1 As shown, a circuit board includes a metal base layer 1, a dielectric layer 2 and a circuit layer 3 stacked in sequence. The circuit board further includes a heat conducting member 4, one end of the heat conducting member 4 is connected to the metal base layer 1, and the other One end passes through the dielectric layer 2 and the circuit layer 3 and is exposed to the surface of the circuit layer 3. When the electronic component 5 is assembled on the circuit board, its bottom can directly contact the heat-conducting member 4, so that the metal base layer 1 will dissipate heat, which greatly improves the thermal conductivity of the circuit board. figure 1 Only part of the structure is shown, and several heat conducting elements 4 can be provided on the entire circuit board as required. And, in figure 1 The circuit layer 3 is taken as an example of a double panel. It can be understood that the circuit layer 3 may also be a single panel, a multiple panel, ...
Embodiment 2
[0022] A method for manufacturing a circuit board includes providing a metal base layer, a dielectric layer, and a circuit layer on which a heat-conducting element is formed on the surface. The dielectric layer and the circuit layer have through holes at positions corresponding to the heat-conducting element. The layer and the circuit layer are pressed together, and the heat-conducting member passes through the dielectric layer and the circuit layer and is exposed to the surface of the circuit layer. It can be understood that the manufactured circuit board is the circuit board described in the first embodiment. When the electronic components are assembled on the circuit board by forming the heat-conducting element, the bottom of the electronic component can directly contact the heat-conducting element, so that the metal base layer can dissipate heat. , Greatly improve the thermal conductivity of the circuit board.
[0023] Preferably, the metal base layer with the heat conductive...
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Abstract
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