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Novel solder paste and preparation method thereof

A solder paste, a new type of technology, applied in welding equipment, welding medium, manufacturing tools, etc., can solve the problems of complex manual pressing process, bulky pressing machine, and reduce the service life of the pressing machine, so as to increase the safety of equipment use Sexuality, increase the convenience of moving and handling, and increase the effect of equipment stability

Inactive Publication Date: 2018-11-30
广州星引科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] When preparing and producing solder paste, it is necessary to press the solder paste to ensure the stability of the solder paste. Manual pressing and mechanical pressing are usually used for solder paste pressing. The manual pressing process is complex and time-consuming. , although the traditional pressing machine is very efficient, but the traditional pressing machine has problems such as bulky, inflexible movement, etc., it is inconvenient to use, and the exposed design of the transmission system brings greater safety hazards to users. There is a lot of wear and tear during the movement or transportation of the laminating machine, which greatly reduces the service life of the laminating machine

Method used

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  • Novel solder paste and preparation method thereof
  • Novel solder paste and preparation method thereof

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Embodiment Construction

[0014] Combine below Figure 1-2 The present invention will be described in detail.

[0015] refer to Figure 1-2 , according to an embodiment of the present invention, a new type of solder paste and its preparation method, comprising preparing a housing 100, a placement cavity 122 is provided in the bottom end surface of the preparation housing 100, and a placement cavity 122 is provided in the top wall of the placement cavity 122. There is an adjustment groove 102, an adjustment seat 101 is installed in the adjustment groove 102, and a first sliding cavity 141 is arranged in the bottom end surface of the adjustment seat 101, and a pressing column 143 is installed in the first sliding cavity 141 , the pressing column 143 extends into the placement cavity 122 and the bottom end is fixed with a pressing plate 142, and the inner walls of the left and right sides of the first sliding cavity 141 are symmetrically provided with guide grooves 137, and sliding in the guide grooves 1...

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Abstract

The invention discloses a novel solder paste and a preparation method thereof. The solder paste comprises a preparation shell body, wherein a placing cavity is formed in the bottom end surface of thepreparation shell body; an adjusting groove is formed in the inner top wall of the placing cavity; an adjusting seat is mounted in the adjusting groove in a sliding and matched manner; a first slidingcavity is formed in the bottom end surface of the adjusting seat; a pressing column is mounted in the first sliding cavity in a sliding and matched manner; the pressing column extends into the placing cavity, and a pressing plate is fixedly arranged at the bottom end; guiding grooves are symmetrically formed in the inner walls of the left and right sides of the first sliding cavity; guiding blocks fixedly connected with the pressing column are mounted in the guiding grooves in a sliding and matched manner; first elastic strips are mounted in the guiding grooves at the bottom ends of the guiding blocks in a top press and matched manner; a pressure cavity is formed in the inner top wall of the first sliding cavity; and a first piston block is mounted on the right side of the pressure cavityin an up-down sliding and matched manner.

Description

technical field [0001] The invention relates to the field of soldering technology, in particular to a novel solder paste and a preparation method thereof. Background technique [0002] When preparing and producing solder paste, it is necessary to press the solder paste to ensure the stability of the solder paste. Manual pressing and mechanical pressing are usually used for solder paste pressing. The manual pressing process is complex and time-consuming. , although the traditional pressing machine is very efficient, but the traditional pressing machine has problems such as bulky, inflexible movement, etc., it is inconvenient to use, and the exposed design of the transmission system brings greater safety hazards to users. There is a lot of wear and tear in the process of moving or transporting the laminating machine, which greatly reduces the service life of the laminating machine. Contents of the invention [0003] The object of the present invention is to provide a novel ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B23K35/40
CPCB23K35/362B23K35/40
Inventor 陆伟城
Owner 广州星引科技有限公司
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