A method for testing the performance of pcb solder resist ink

Abstract

The invention discloses a PCB solder mask ink performance test method. A plate is divided into twelve modules, several detecting working procedures which do not affect one another are concentrated onone of the certain modules, the ink thickness, the hardness, the adhesion, chemical resistance and the like are tested simultaneously, the twelve modules are utilized to conduct experiment data collection and experiment operation, thus the testing item in one-time testing is more comprehensive, performance testing of the solder mask ink is more accurate, and the situation that abnormal badness occurs in batch use, and reassessment and reconfirmation are needed is avoided.

Description

technical field

[0001] The invention relates to the field of detection methods, in particular to a method for testing the performance of PCB solder resist ink. Background technique

[0002] At present, the performance evaluation tests of solder resist inks in the PCB industry are not complete, and most of them use scrap boards or a single test module for performance evaluation. Due to the unsound evaluation and test items, abnormal defects occur in batch use, which needs to be re-evaluated and confirmed. At the same time, new requirements are put forward for customers, and the corresponding solder mask ink cannot be selected as a reference, and it needs to be purchased temporarily before evaluation, delaying the delivery time, and affecting market quotations. Contents of the invention

[0003] The present invention aims to solve one of the above-mentioned technical problems in the related art at least to a certain extent. For this reason, the present invention proposes a ...

Examples

Embodiment Construction

[0016] A kind of PCB solder resist ink performance test method of the present invention,

[0017] A method for testing the performance of PCB solder resist ink, comprising the following steps:

[0018] Cutting: Divide a board into three columns and four rows on average, and number modules 1 to 12 to make test boards; visually inspect all boards; conduct thickness test on module 7; conduct hardness test on all modules; Focus on testing: Use tape method to perform adhesion pull test on all panels to check whether there is no oil throwing or falling off; test via hole: use tape method to perform adhesion pull test on the via hole of module 5 to check whether there is no peeling, No cracking, no delamination; test machinability: check whether there is no splitting, no explosion, and no delamination on module 7; test flux resistance: put module 7 completely into flux for 30 minutes and then use 3M adhesive tape Adhesion pull; test chemical resistance: use 10% sulfuric acid, 10% so...

technical field

[0001] The invention relates to the field of detection methods, in particular to a method for testing the performance of PCB solder resist ink. Background technique

[0002] At present, the performance evaluation tests of solder resist inks in the PCB industry are not complete, and most of them use scrap boards or a single test module for performance evaluation. Due to the unsound evaluation and test items, abnormal defects occur in batch use, which needs to be re-evaluated and confirmed. At the same time, new requirements are put forward for customers, and the corresponding solder mask ink cannot be selected as a reference, and it needs to be purchased temporarily before evaluation, delaying the delivery time, and affecting market quotations. Contents of the invention

[0003] The present invention aims to solve one of the above-mentioned technical problems in the related art at least to a certain extent. For this reason, the present invention proposes a ...

Examples

Embodiment Construction

[0016] A kind of PCB solder resist ink performance test method of the present invention,

[0017] A method for testing the performance of PCB solder resist ink, comprising the following steps:

[0018] Cutting: Divide a board into three columns and four rows on average, and number modules 1 to 12 to make test boards; visually inspect all boards; conduct thickness test on module 7; conduct hardness test on all modules; Focus on testing: Use tape method to perform adhesion pull test on all panels to check whether there is no oil throwing or falling off; test via hole: use tape method to perform adhesion pull test on the via hole of module 5 to check whether there is no peeling, No cracking, no delamination; test machinability: check whether there is no splitting, no explosion, and no delamination on module 7; test flux resistance: put module 7 completely into flux for 30 minutes and then use 3M adhesive tape Adhesion pull; test chemical resistance: use 10% sulfuric acid, 10% so...