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Semiconductor device

A semiconductor, hierarchical technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve problems such as adverse effects on the overall performance of integrated circuits

Inactive Publication Date: 2018-12-04
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In turn, the overall performance of the integrated circuit can be adversely affected
Therefore, conventional methods for forming interconnects in integrated circuits are not entirely satisfactory

Method used

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  • Semiconductor device
  • Semiconductor device
  • Semiconductor device

Examples

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Embodiment Construction

[0024] The following disclosure sets forth various exemplary embodiments for implementing different features of the subject matter. Specific examples of components and constructions are set forth below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, it will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or one or more intervening elements may be present. element.

[0025] The present disclosure provides various embodiments of a semiconductor device and a method of forming the same. The semiconductor device includes at least one interconnection spaced apart from other interconnections by at least one level. The term "tier" as used herein refers to a layer at a corresponding level formed on a substrate of a semiconductor device and including one or more interconnect lines (conductive segm...

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Abstract

A semiconductor device includes: first, second, and third tiers formed on a substrate, wherein the first tier is formed over the substrate, the second tier is formed over the first tier, and the thirdtier is formed over the second tier, wherein the second tier comprises a first interconnection line that is configured to transmit a signal, and wherein a portion of the first tier disposed directlyunder the first interconnection line of the second tier lacks any interconnection lines and a portion of the third tier disposed directly above the first interconnection line of the second tier lacksany interconnection lines.

Description

technical field [0001] Embodiments of the present invention relate to a semiconductor device. More specifically, embodiments of the present invention relate to a semiconductor device including at least one interconnection spaced apart from other interconnections by at least one level. Background technique [0002] Typically, in an integrated circuit (IC), signal contacts, power contacts, and / or ground contacts to their respective desired locations, and also interconnect the corresponding coupled active devices to form functional circuitry. As integrated circuits have become more powerful in accordance with the reduction in integrated circuit geometries, interconnects have correspondingly become closer to each other. Specifically, interconnects located in adjacent levels or in the same level typically couple to each other through electromagnetic coupling effects when the interconnects are sufficiently close to each other, and this effectively creates a coupling between the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/528
CPCH01L23/528H01L23/5283
Inventor 郑朝元黄天建
Owner TAIWAN SEMICON MFG CO LTD
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