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Microelectromechanical(MEMS) system chip wafer and system packaging method, and microelectromechanical system

A micro-electro-mechanical system and wafer packaging technology, applied in the field of micro-electro-mechanical systems, can solve the problems of inability to realize wafer-level packaging of MEMS chips and ASIC chips, and achieve the effect of ensuring high-speed signal transmission and improving performance

Pending Publication Date: 2018-12-11
北京万应科技有限公司
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Problems solved by technology

[0005] Based on this, it is necessary to provide a micro-electro-mechanical sys

Method used

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  • Microelectromechanical(MEMS) system chip wafer and system packaging method, and microelectromechanical system
  • Microelectromechanical(MEMS) system chip wafer and system packaging method, and microelectromechanical system
  • Microelectromechanical(MEMS) system chip wafer and system packaging method, and microelectromechanical system

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Embodiment Construction

[0048] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

[0049] like figure 1 Shown is a schematic flow chart of a MEMS chip wafer packaging method of the present invention, including:

[0050] Step S101, temporarily bonding the front surface of the MEMS chip 11 to the MEMS carrier board 12;

[0051] Step S102, embedding the MEMS chip 11 in the organic resin 13 to obtain a wafer embedded with the chip;

[0052]Step S103, debonding the MEMS carrier board 12 from the wafer, and exposing the MEMS pins 14 on the MEMS chip;

[0053] Step S104, fabricating a MEMS insulation layer 15 on the front surface of the MEMS chip 11;

[0054] Step S105, removing the MEMS insulation layer at the position corresponding to the MEMS pin 14 of the MEMS chip to form a blind hole 16;

[0055] Step S106, fabricate the MEMS redistribution layer 17 electrically connected to the MEMS pin 14 through the blind hole...

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Abstract

The invention discloses a MEMS chip wafer and a system packaging method, and a MEMS. The wafer packaging method comprises the following steps:a front surface of the MEMS chip and an MEMS carrier plateare temporarily bonded ;the MEMS chip is embedded in the organic resin; a MEMS carry plate and a wafer are debonded, and MEMS pins on the MEMS chip are exposed; a lay of MEMS insulating lay is fabricated; the MEMS insulating layer at the corresponding position of the MEMS pins of the MEMS chip is removed to form blind holes; an MEMS rewiring layer electrically connected with MEMS pins is fabbricated, passivation layer is fabrication, and an MEMS under-sphere metal layer is fabricated; an MEMS bump electrically connected to the MEMS pin is fabricated to obtain a MEMS chip wafer which is fan-out packaged. The MEMS chip is packaged in a fan-out package form, so the the size of the MEMS chip can be packaged at the wafer level with the ASIC chip wafer.

Description

technical field [0001] The invention relates to the technical field related to micro-electro-mechanical systems, in particular to a micro-electro-mechanical system chip wafer, a system packaging method, and a micro-electro-mechanical system. Background technique [0002] Micro-Electro-Mechanical System (MEMS) chips are micro-sensors, micro-actuators, micro-mechanical structures, micro-power sources, signal processing and control circuits, high-performance electronic integrated chips, interfaces, and communications. Microchips, which are widely used in high-tech industries. [0003] Usually, an application specific integrated circuit (Application Specific Integrated Circuit, ASIC) chip is designed to drive the MEMS chip to form a micro-electromechanical system. [0004] However, the production of existing MEMS chips is based on 6-inch or 8-inch wafer technology, while most of the general IC chips are 8-inch or 12-inch wafer technology, so the size of MEMS chips is not suitab...

Claims

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Application Information

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IPC IPC(8): B81B7/02B81C1/00
CPCB81B7/02B81B2207/00B81C1/00309B81C2203/0118B81C2203/0785
Inventor 黄玲玲
Owner 北京万应科技有限公司
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