A low-foaming high-adhesion photosensitive dry film resist

Abstract

The invention discloses a low-foaming high-adhesion photosensitive dry film resist. The photosensitive dry film resist mainly consists of 45-75wt% alkali-soluble copolymer resin with a weight-average molecular weight of 50,000-150,000, 15-45wt% % ethylenic photopolymerizable unsaturated monomer and 0.5-10wt% photopolymerization initiator, wherein, the ethylenic photopolymerizable unsaturated monomer consists of acrylate compounds and molecules containing phosphorylcholine structure It is composed of a mixture of compounds containing vinyl unsaturated bonds in the structure; the photosensitive dry film resist prepared by the present invention has low foaming and high adhesion performance, effectively avoiding the risk of developing solution overflow during the development process and the risk of seeping, plating, and plating during the electroplating process. The phenomenon of short circuit greatly improves the production efficiency and yield of circuit boards.

Description

technical field [0001] The invention relates to a resist, in particular to a low-foaming high-adhesion photosensitive dry film resist. Background technique [0002] In recent years, with the rapid development of integrated, intelligent, miniaturized and multi-functional printed circuits, there is an increasing demand for integrated circuits with high density and narrow wiring in practical applications. This puts forward higher requirements for fine resolution, excellent adhesion, and higher developing efficiency of photosensitive dry film. [0003] In the conventional printed circuit board preparation process, the process of dispersing or dissolving the unexposed part of the photosensitive resin composition and removing it from the circuit board with an alkaline developer is called a developing process. During the development process, a large amount of hydrophilic and hydrophobic substances contained in the dry film continuously foam under high spray pressure, which makes t...

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Problems solved by technology

[0004] In order to improve the adhesion of dry film resist, such as the viscosity enhancer of silane coupling agent, but the storage stability of dry film resist is destroyed due to the chemical property of the viscosity enhancer itself is not stable enough

Patent CN200480012068 reports the use of acrylic resin containing phosphate ester to improve the adhesion and pattern forming ability of photosensitive dry film resist, but the degree of improvement is extremely limited

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