Motherboard packaging device with dust removing function for computer hardware development

A technology of computer hardware and packaging equipment, which is applied in computing, digital data processing parts, instruments, etc., can solve the problems of poor dust removal effect, affecting sales, single function, etc., and achieve the effect of good packaging effect

Inactive Publication Date: 2018-12-21
上海宴阳智能科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] It needs to be packaged during the production process of the motherboard, but most of the existing computer motherboard packaging equipment has simple structure, single function, and poor dust removal effect. During packaging, dust is easily encapsulated in the packaging film, which affects the overall appearance. Beauty, affecting the later sales, therefore, in order to make up for the above shortcomings, and then proposed a computer hardware development with dust removal function of the motherboard packaging equipment

Method used

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  • Motherboard packaging device with dust removing function for computer hardware development
  • Motherboard packaging device with dust removing function for computer hardware development
  • Motherboard packaging device with dust removing function for computer hardware development

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0027] refer to Figure 1-5 , a kind of motherboard packaging equipment with dust removal function for computer hardware development, comprising a packaging box 1, the bottom inner wall of the packaging box 1 is fixed with a lower packaging mold 2 by screws, and the top of the lower packaging mold 2 is provided with a packaging groove. The inner wall of the groove is fixed with a packaging table 7 by screws, and the bottom inner wall and outer wall of the packaging table 7 are provided with air holes distributed equidistantly. 9. The bottom inner wall of the packaging table 2 is fixed with the first vacuum pump 3 by screws. Two rectangular grooves are opened on the i...

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Abstract

The invention belongs to the technical field of packaging equipment, in particular to a motherboard encapsulation device with a dust removing function for computer hardware development, aiming at thetechnical problem that dust is easily encapsulated in the encapsulation film when encapsulating, the following programs are proposed, the device includes an encapsulated case, the bottom inner wall ofthe packaging box body is fixed with a lower packaging mold by screws, and the top of the lower packaging mold is provided with a packaging groove, the inner wall of the packaging groove is fixed with a packaging table by screws, the outer wall of the bottom inner wall of the packaging table is provided with air holes distributed at equal distances, the outer wall of the top of the packaging table is provided with a main board, and the outer wall of the top of the main board is provided with a packaging film. The electric expansion rod drives the sliding plate to move downward to seal the main board, and the booster pressurizes, thereby facilitating the close bonding of the encapsulation film and the main board and facilitating the encapsulation work.

Description

technical field [0001] The invention relates to the technical field of packaging equipment, in particular to a main board packaging equipment with dust removal function for computer hardware development. Background technique [0002] Computer case motherboard, also known as motherboard, system board or motherboard; it is divided into two types: commercial motherboard and industrial motherboard. It is installed in the chassis and is one of the most basic and important components of the microcomputer. The motherboard is generally a rectangular circuit board, on which are installed the main circuit systems that make up the computer. Generally, there are BIOS chips, I / O control chips, keys and panel control switch interfaces, indicator light connectors, expansion slots, motherboards and cards. DC power supply connectors and other components. [0003] It needs to be packaged during the production process of the motherboard, but most of the existing computer motherboard packagin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/182G06F1/183G06F1/20G06F2200/1638
Inventor 陈浩
Owner 上海宴阳智能科技有限公司
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