Motherboard packaging device with dust removing function for computer hardware development

Abstract

The invention belongs to the technical field of packaging equipment, in particular to a motherboard encapsulation device with a dust removing function for computer hardware development, aiming at thetechnical problem that dust is easily encapsulated in the encapsulation film when encapsulating, the following programs are proposed, the device includes an encapsulated case, the bottom inner wall ofthe packaging box body is fixed with a lower packaging mold by screws, and the top of the lower packaging mold is provided with a packaging groove, the inner wall of the packaging groove is fixed with a packaging table by screws, the outer wall of the bottom inner wall of the packaging table is provided with air holes distributed at equal distances, the outer wall of the top of the packaging table is provided with a main board, and the outer wall of the top of the main board is provided with a packaging film. The electric expansion rod drives the sliding plate to move downward to seal the main board, and the booster pressurizes, thereby facilitating the close bonding of the encapsulation film and the main board and facilitating the encapsulation work.

Description

technical field [0001] The invention relates to the technical field of packaging equipment, in particular to a main board packaging equipment with dust removal function for computer hardware development. Background technique [0002] Computer case motherboard, also known as motherboard, system board or motherboard; it is divided into two types: commercial motherboard and industrial motherboard. It is installed in the chassis and is one of the most basic and important components of the microcomputer. The motherboard is generally a rectangular circuit board, on which are installed the main circuit systems that make up the computer. Generally, there are BIOS chips, I / O control chips, keys and panel control switch interfaces, indicator light connectors, expansion slots, motherboards and cards. DC power supply connectors and other components. [0003] It needs to be packaged during the production process of the motherboard, but most of the existing computer motherboard packagin...

AI Technical Summary

Problems solved by technology

[0003] It needs to be packaged during the production process of the motherboard, but most of the existing computer motherboard packaging equipment has simple structure, single function, and poor dust removal effect. During packaging, dust is easily encapsulated in the packaging film, which affects the overall appearance. Beauty, affecting the later sales, therefore, in order to make up for the above shortcomings, and then proposed a computer hardware development with dust removal function of the motherboard packaging equipment

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