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A microchannel cold plate

A technology of micro-channel and cold plate, which is applied in the direction of using liquid cooling for modification, cooling/ventilation/heating modification, electrical components, etc. It can solve problems such as low radiator temperature, uneven temperature of cold plate, and increased flow resistance.

Active Publication Date: 2020-02-14
LEIHUA ELECTRONICS TECH RES INST AVIATION IND OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The currently designed micro-channel cold plates all adopt a straight-through flow channel structure, and the coolant flows through each micro-channel radiator one by one along the straight-through flow channel for heat exchange, which leads to a low temperature of the radiator where the coolant first exchanges heat, and then heat exchange The temperature of the radiator is high, and the temperature of the cold plate is extremely uneven; in addition, due to the limitation of the heat dissipation efficiency of the microchannel fins, the height of the heat dissipation fins generally cannot exceed 5 times the thickness of the fins. Therefore, the cross-sectional area of ​​the microchannel flow channel is far It is much smaller than the traditional cooling plate, which forms a throttling effect on the cooling liquid, and the cooling liquid that dissipates heat from the entire cold plate flows along a direct flow channel, and the flow area is only the cross-sectional area of ​​a flow channel, resulting in a microchannel cold plate for the fluid. Compared with the traditional cold plate, the flow resistance is greatly increased

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  • A microchannel cold plate
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Embodiment Construction

[0039] In order to make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be described in more detail below in conjunction with the drawings in the embodiments of the present invention. In the drawings, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The described embodiments are some, but not all, embodiments of the invention. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention. Embodiments of the present invention will be described in detail below ...

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Abstract

The invention relates to the technical field of heat exchange of electronic equipment, in particular to a microchannel cold plate. According to the design, the cooling channels through which the designed coolant flows are a liquid inlet channel, a liquid inlet tank, a liquid inlet collection tank, a microchannel, an effluent collection tank, s liquid outlet tank, and a liquid outlet channel; whenflowing through the cooling channel, the coolant flows through the flow inlet channels, the liquid inlet channel, the heat dissipation channel, the liquid outlet channel and the flow outlet channel for multi-stage flow distribution; the cooling channels are designed in parallel; when the coolant flows through the cooling channels, heat transfer is performed only at the microchannel, heat accumulation does not occur in the direct outflow after heat exchange, the cooling effect is increased, and the cool effect is uniform; compared with a straight flow channel structure, the coolant flows through the microchannel only once, that is, the coolant flows through only one set of cooling fins when the coolant passes through the cooling channels, thereby greatly reducing the throttling effect of the cooling fin on the coolant, at the same time, the flow path of the coolant is greatly shortened, and the flow resistance of the coolant is greatly reduced.

Description

technical field [0001] The invention relates to the technical field of heat exchange of electronic equipment, in particular to a microchannel cold plate. Background technique [0002] In recent years, the integration degree and thermal load of electronic equipment have increased geometrically. Due to the limitation of equipment volume, temperature balance and flow resistance, it is required that the cooling device should have micro volume, good temperature balance and flow resistance. inferior features. [0003] The micro-channel heat dissipation that is gradually rising at present has a small volume and can well solve the heat dissipation requirements of high heat flux. The so-called micro-channel refers to a channel with a hydraulic diameter of a fluid channel ranging from a few microns to a few hundred microns, and the thickness of its cooling fins ranges from a few microns to a few hundred microns, which makes the number of fins double in the same flow channel space. T...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/2029H05K7/20327H05K7/20336
Inventor 糜勇齐瑞骞付林
Owner LEIHUA ELECTRONICS TECH RES INST AVIATION IND OF CHINA