Punching forming die of high-density packaged SOT type lead frame and using method thereof

Abstract

The invention discloses a punching forming die of high-density packaged SOT type lead frame and a using method of the punching forming die. The punching forming die comprises a punching forming die body (1), a feeding cover plate (2), feeding tracks (3) and roller wheel feeding mechanisms (4), wherein the feeding cover plate (2) is positioned in the punching forming die body, the feeding tracks (3) are positioned at the two ends of the punching forming die body, and the roller wheel feeding mechanisms (4) are positioned at the two ends of the punching forming die body. The punching forming diebody is internally divided into a punching stage (5), a pin forming stage (6) and a formed product blanking port (7) in the advancing direction of the lead frame. The roller wheel feeding mechanism comprises a front roller wheel feeding mechanism and a rear roller wheel feeding mechanism, wherein the front roller wheel feeding mechanism is positioned in front of the punching forming die body, andthe rear roller wheel feeding mechanism is positioned behind the punching forming die body. The punching forming die body comprises an upper die and a lower die, and the gap between the feeding coverplate and the lower die is 0.1-0.2mm. The punching forming die has the beneficial effects that a claw-free die and a high-speed feeding mode are used to realize the movement of the high-density SOT packaging lead frame in the die according to a set step distance.

Description

technical field [0001] The invention relates to the technical field of punching and molding of integrated circuits, in particular to a punching and molding die for a high-density packaging SOT lead frame and a method for using the same. Background technique [0002] With the continuous progress of semiconductor technology, the packaging density of lead frames of SOT products is getting higher and higher, and at the same time, packaging factories have higher and higher requirements for the production capacity of SOT products punching and forming equipment. The action sequence of the traditional SOT lead frame punching and forming equipment needs to match the mold clamping, claw movement, and claw lifting actions at the same time, so the punching speed is only 110 times / min at the highest. The production capacity requirements of SOT lead frame punching and forming equipment generally require 180 times / min. In the existing punching and forming process, the arrangement of the g...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is that the existing high-density SOT product lead frame punching dies can only complete the rib cutting and forming processes, and the separation process needs to be completed with other separation equipment, which consumes extra man-hours At the same time, the die-cutting mold adopts stop nails and claws to cooperate with the lead frame to feed the die into the die-cutting die. A kind of high-density packaging SOT lead frame punching molding die and using method thereof

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