Processing method for housing assembly, housing assembly and electronic device

A shell assembly and processing method technology, applied in branch office equipment, telephone communication, electrical components, etc., can solve problems such as visual abruptness, affecting the aesthetics of electronic equipment, and failure to meet user needs, so as to reduce processing costs and improve appearance performance Power, enhance the effect of aesthetics

Active Publication Date: 2019-01-11
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The single-tone back cover can no longer meet the needs of users
In the related art, in order to increase the diversity of the color tone of the back cover of the electronic device, the back cover of the el

Method used

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  • Processing method for housing assembly, housing assembly and electronic device
  • Processing method for housing assembly, housing assembly and electronic device
  • Processing method for housing assembly, housing assembly and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0103] Embodiment 1: The processing method of the housing assembly 100 according to the embodiment of the present invention includes the following steps:

[0104] The inner surface 12 of the board is hardened, and the silk screen layer 5, the color film layer 4, the scintillation layer 2, the gradient layer 3, and the backing layer 6 are sequentially formed on the inner surface 12 of the board, and then the board is cut by a CNC process.

Example Embodiment

[0105] Embodiment 2: The processing method of the housing assembly 100 according to the embodiment of the present invention includes the following steps:

[0106] The inner surface 12 of the board is hardened, and the silk screen layer 5, the color film layer 4, the scintillation layer 2, the second enhanced adhesion layer 8, the gradient layer 3, and the substrate layer 6 are sequentially formed on the inner surface 12 of the board. The process cuts the plate.

Example Embodiment

[0107] Embodiment 3: The processing method of the housing assembly 100 according to the embodiment of the present invention includes the following steps:

[0108] The inner surface 12 of the board is hardened, and the silk screen layer 5, the color film layer 4, the first enhanced adhesion layer 7, the scintillation layer 2, the gradient layer 3, and the substrate layer 6 are sequentially formed on the inner surface 12 of the board. The process cuts the plate.

[0109] The housing assembly 100 according to the embodiment of the second aspect of the present invention includes: a base 1, a scintillation layer 2 and a gradient layer 3. The housing assembly 100 can be used in the electronic device 1000. The housing assembly 100 in this embodiment may be processed by the processing method of the housing assembly 100 according to the embodiment of the first aspect of the present invention, or may be processed by other processing methods.

[0110] Such as Figure 8 As shown, the base body...

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Abstract

The invention discloses a processing method for a housing assembly, the housing assembly and an electronic device. The processing method for the housing assembly comprises a step of providing a board,wherein the board comprises an appearance surface and an inner side surface facing each other; a scintillation layer is formed on the inner side surface of the board, and the scintillation layer covers at least a part of the inner side surface; and one side, away from the board, of the scintillation layer forms a gradient layer which covers at least a part of the scintillation layer. According tothe processing method for the housing assembly in embodiments of the invention, by sequentially arranging the scintillation layer and the gradient layer on the inner side surface of the board, the board can present the effect of flickering and color gradation, so the aesthetic sensation of the board can be enhanced, and the appearance expression of the housing assembly is greatly improved. In addition, the processing method is simple and easy to implement, which can simplify the processing process of the board and reduce the processing cost of the board.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a processing method for a housing assembly, the housing assembly and electronic equipment. Background technique [0002] With the increasing popularity of electronic equipment and the improvement of processing technology, the appearance expressiveness of electronic equipment has developed into the main competition point of electronic equipment. A single-tone back cover can no longer meet the needs of users. In the related art, in order to increase the diversity of the color tone of the back cover of the electronic device, the back cover of the electronic device is provided with a variety of tones, but the dividing line between the various tones is relatively obvious, which is visually abrupt and affects the appearance of the electronic device sex. Contents of the invention [0003] The present invention aims to solve at least one of the technical problems existin...

Claims

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Application Information

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IPC IPC(8): B44C5/04B44C3/02H04M1/02
CPCB44C3/025B44C5/0446H04M1/0283
Inventor 龚清国
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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