Processing method for housing assembly, housing assembly and electronic device
A shell assembly and processing method technology, applied in branch office equipment, telephone communication, electrical components, etc., can solve problems such as visual abruptness, affecting the aesthetics of electronic equipment, and failure to meet user needs, so as to reduce processing costs and improve appearance performance Power, enhance the effect of aesthetics
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Example Embodiment
[0103] Embodiment 1: The processing method of the housing assembly 100 according to the embodiment of the present invention includes the following steps:
[0104] The inner surface 12 of the board is hardened, and the silk screen layer 5, the color film layer 4, the scintillation layer 2, the gradient layer 3, and the backing layer 6 are sequentially formed on the inner surface 12 of the board, and then the board is cut by a CNC process.
Example Embodiment
[0105] Embodiment 2: The processing method of the housing assembly 100 according to the embodiment of the present invention includes the following steps:
[0106] The inner surface 12 of the board is hardened, and the silk screen layer 5, the color film layer 4, the scintillation layer 2, the second enhanced adhesion layer 8, the gradient layer 3, and the substrate layer 6 are sequentially formed on the inner surface 12 of the board. The process cuts the plate.
Example Embodiment
[0107] Embodiment 3: The processing method of the housing assembly 100 according to the embodiment of the present invention includes the following steps:
[0108] The inner surface 12 of the board is hardened, and the silk screen layer 5, the color film layer 4, the first enhanced adhesion layer 7, the scintillation layer 2, the gradient layer 3, and the substrate layer 6 are sequentially formed on the inner surface 12 of the board. The process cuts the plate.
[0109] The housing assembly 100 according to the embodiment of the second aspect of the present invention includes: a base 1, a scintillation layer 2 and a gradient layer 3. The housing assembly 100 can be used in the electronic device 1000. The housing assembly 100 in this embodiment may be processed by the processing method of the housing assembly 100 according to the embodiment of the first aspect of the present invention, or may be processed by other processing methods.
[0110] Such as Figure 8 As shown, the base body...
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