A kind of wafer detection method

Abstract

The invention belongs to the technical field of electronic product processing and production, and discloses a wafer detection method, which includes S1, providing a wafer detection device, the wafer detection device is provided with at least a macro detection station and a micro detection station; S2, Transporting the wafer to be inspected to the macro inspection station and / or the micro inspection station, and performing macro inspection and / or micro inspection on the wafer to be inspected; S3, moving the inspected wafer out of the wafer Round detection equipment. The wafer inspection method of the present invention provides a wafer inspection device with a macro inspection station and a micro inspection station, so that the wafer can be inspected macroscopically and microscopically. Defects: The micro-inspection station mainly observes the defects on the wafer that are invisible to the naked eye through microscope equipment, so that it can comprehensively detect and analyze the defects of the wafer caused by the processing technology, so as to make timely improvements.

Description

technical field [0001] The invention relates to the technical field of electronic product processing and production, in particular to a wafer detection method. Background technique [0002] Wafer microdisplay devices are different from conventional AMOLED devices that use amorphous silicon, microcrystalline silicon or low-temperature polysilicon thin film transistors as backplanes. They use monocrystalline silicon chips as the base, and the pixel size is 1 / 10 of that of traditional display devices. [0003] Wafer microdisplays have a broad market application space, especially suitable for helmet-mounted displays, stereoscopic display mirrors, and eye displays, and can be used for portable computers, wireless Internet browsers, portable DVDs, game platforms, and wearable computers. Mobile information products provide high-quality video display, and even when combined with mobile communication networks and satellite positioning systems, accurate image information can be obtain...

AI Technical Summary

Problems solved by technology

[0004] At present, the technology of ultra-micro display and near-eye large-screen equipment with wafer as the core is relatively new, and the wafer manufacturing process is still in the stage of exploration and trial. Therefore, there may be some defects in the wafer manufacturing process. The adjustment of the manufacturing process in the wafer requires defect inspection on the wafer. However, the existing market is still lacking in wafer inspection methods

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