Interface detect detection method based on improved multi-reflection full focusing imaging algorithm

A technology for multiple reflection and defect detection, which is applied in measuring devices, analyzing solids using sound waves/ultrasonic waves/infrasonic waves, and using sound waves/ultrasonic waves/infrasonic waves for material analysis, etc., can solve problems such as debonding strength weakening, and achieve defect feature enhancement , Improving the effect of accuracy and detection rate

Active Publication Date: 2019-01-15
FUZHOU UNIV
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Problems solved by technology

However, in the process of processing and use, it is inevitable that there will be defects such as debonding, holes, microporosity and strength weakening in the bonding layer.

Method used

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  • Interface detect detection method based on improved multi-reflection full focusing imaging algorithm
  • Interface detect detection method based on improved multi-reflection full focusing imaging algorithm
  • Interface detect detection method based on improved multi-reflection full focusing imaging algorithm

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Embodiment Construction

[0038] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0039] The invention provides a method for detecting interface defects based on an improved multi-reflection total-focus imaging algorithm, and the detection object is such as figure 1 Debonding defects of the bonded structure shown, including the following steps

[0040] Step S1: According to the interface depth S and the time required for receiving P echoes, set the instrument parameters: assuming that the propagation speed of the sound wave in the workpiece is c, the maximum distance from the array element in the probe to the target imaging point (x, z) is u, Set the gate time T for the instrument to receive the echo as:

[0041]

[0042] Step S2: adopt full matrix capture technology to carry out echo capture of the workpiece to be measured;

[0043] Step S21: Sequentially excite each element of the phased array probe to emit ultrasonic waves, a...

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Abstract

The invention relates to an interface detect detection method based on an improved multi-reflection full focusing imaging algorithm. The method comprises the following steps: step S1, according to interface depth S and duration needed for receiving echo for P times, setting instrument parameters; step S2, performing echo capturing for a to-be-tested workpiece through a full matrix capturing technology; step S3, performing virtual focusing for each discrete target imaging point in a to-be-tested region through the improved multi-reflection full focusing imaging algorithm, and thereby obtainingan interface detect detection result of the to-be-tested region. The method provided by the invention is based on the improved multi-reflection full focusing imaging algorithm, acquires echo of many times and performs depth accumulation for target imaging point information contained in the echo of each time, thus, features of interface defects are highlighted, and detection rate of defects of unsticking is improved greatly.

Description

technical field [0001] The invention relates to the technical field of defect positioning in ultrasonic nondestructive testing, in particular to an interface defect detection method based on an improved multi-reflection total focus imaging algorithm. Background technique [0002] The bonded structure has the characteristics of high specific strength and specific modulus, superior shock absorption performance and simple process, and has gradually replaced the traditional combination technology in the field of industrial manufacturing and other fields. However, in the process of processing and use, defects such as debonding, holes, micropores and strength weakening will inevitably appear in the bonding layer. Therefore, it is of great practical significance to study an efficient and accurate nondestructive testing method for bonded structures. [0003] In recent years, ultrasonic phased arrays have gradually been developed and applied in the field of non-destructive testing f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N29/04G01N29/07
CPCG01N29/043G01N29/07G01N2291/011G01N2291/023G01N2291/0422
Inventor 钟舜聪范学腾伏喜斌沈耀春
Owner FUZHOU UNIV
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