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A buffer positioning mold assembly guide structure

A technology of guiding structure and buffer mechanism, which is applied in the mechanical field, can solve the problems of guide post and guide sleeve wear, inaccurate positioning, large error, etc., and achieve the effect of small self-adaptive resistance

Active Publication Date: 2021-01-29
SHANGHAI VICO PRECISION MOLD & PLASTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Due to the continuous relative movement between the upper mold and the lower mold, there must be a certain gap between the guide post and the guide sleeve to ensure unobstructed movement. If the gap is too large, the positioning will be inaccurate and the error will be large; if the gap is too small, the friction will be increased, the wear of the guide post and guide sleeve will be serious, the service life will be reduced, and the cost investment will be increased. trouble

Method used

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  • A buffer positioning mold assembly guide structure
  • A buffer positioning mold assembly guide structure

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Embodiment Construction

[0022] The present invention will be further described below in combination with specific embodiments and accompanying drawings.

[0023] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, and are not intended to limit the present invention

[0024] Such as Figure 1-2 It is an embodiment of a buffer positioning mold assembly guide structure of the present invention. A buffer positioning mold assembly guide structure includes: an upper mold 101 and a lower mold 102, and the joint surfaces of the upper mold 101 and the lower mold 102 are respectively It has an upper guide structure 1 and a lower guide structure 2, the upper guide structure 1 includes: an upper seat 11, the bottom of the upper...

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Abstract

The invention discloses a buffer positioning mold assembly guide structure, which comprises: an upper mold and a lower mold, an upper guide structure and a lower guide structure are respectively provided between the joint surfaces of the upper mold and the lower mold, and the upper guide structure and the lower guide structure The guide structure has multi-level buffer contact, which can be adjusted in time during the assembly process. The wall avoids direct rigid contact, which improves the service life and assembly accuracy. The self-adaptive function enables the positioning of the upper mold and the lower mold, and the upper mold and the lower mold are locked by the locking mechanism after the positioning contacts.

Description

technical field [0001] The invention relates to the mechanical field, in particular to a mold assembly guide structure for cushioning and positioning. Background technique [0002] In the field of molds, guide sleeves and guide posts are commonly used as the guide device of the mold to ensure that the upper and lower molds are aligned in an accurate positional relationship. Due to the continuous relative movement between the upper mold and the lower mold, there must be a certain gap between the guide post and the guide sleeve to ensure unobstructed movement. If the gap is too large, the positioning will be inaccurate and the error will be large; if the gap is too small, the friction will be increased, the wear of the guide post and guide sleeve will be serious, the service life will be reduced, and the cost investment will be increased. trouble. In view of this, there is an urgent need for a new type of guide device with small error, easy positioning and durability. Cont...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21D37/12B29C33/30
CPCB21D37/12B29C33/303F16F15/0232F16F15/046F16F15/06F16F2222/126F16F2238/026
Inventor 张万军
Owner SHANGHAI VICO PRECISION MOLD & PLASTICS
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