Semiconductor packaging structure used for driving motor and motor

A technology of motor drive and packaging structure, applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problems of increased cost, complicated motor process, cumbersome process, etc., to speed up the production process of the motor, simplify the The process of making the motor, the effect of simplifying the process and the associated costs

Inactive Publication Date: 2019-01-18
SUNONWEALTH ELECTRIC MACHINE IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The components driven by the known motor are usually made with different processes, and the components are assembled into a drive assembly, which makes it difficult to further reduce the size of the drive assembly of the known motor. Drive components are complex and costly
In addition, when assembling the known motor, there are quite a lot of parts and components of the known motor, which makes the process of making the motor quite complicated and cumbersome, and the size of the known motor is difficult to reduce

Method used

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  • Semiconductor packaging structure used for driving motor and motor
  • Semiconductor packaging structure used for driving motor and motor
  • Semiconductor packaging structure used for driving motor and motor

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Embodiment Construction

[0062] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0063] figure 1 A schematic cross-sectional view showing an embodiment of a semiconductor package structure for driving a motor according to the present invention. refer to figure 1 , the semiconductor package structure 10 of the present invention is applied to a motor, and can control and drive the motor. In one embodiment, the semiconductor packaging structure 10 includes a coil assembly 11 , a motor driving unit 12 and packaging material 13 . The coil assembly 11 and the...

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Abstract

The invention relates to a semiconductor packaging structure used for driving a motor and the motor. The semiconductor packaging structure comprises a coil assembly, a motor driving unit, packaging materials and a hole. The coil assembly is manufactured by the semiconductor technology. The motor driving unit is manufactured by the semiconductor technology and electrically connected with the coil assembly. The packaging materials are used for packaging the coil assembly. The motor driving unit is a semiconductor packaging structure. The hole is formed in a set position of the semiconductor packaging structure. By use of the hole, the semiconductor packaging structure can be easily combined with other elements of the motor, so technology for manufacturing the motor can be greatly simplifiedand accelerated, and the motor can be miniaturized.

Description

technical field [0001] The invention relates to a semiconductor packaging structure and a motor for driving a motor. Background technique [0002] The components driven by the known motor are usually made with different processes, and the components are assembled into a drive assembly, which makes it difficult to further reduce the size of the drive assembly of the known motor. The drive components are complex and costly. In addition, when assembling the known motor, there are quite a lot of components of the known motor, which makes the process of making the motor quite complicated and cumbersome, and the size of the known motor is difficult to reduce. Contents of the invention [0003] The present invention provides a semiconductor package structure for motor driving. In one embodiment, the semiconductor packaging structure includes: a coil component, a motor driving unit, packaging material and a hole. The coil assembly is made with semiconductor technology. The mot...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/58H01L23/64
CPCH01L23/31H01L23/58H01L23/64
Inventor 洪银树李明聪吕立洋
Owner SUNONWEALTH ELECTRIC MACHINE IND
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