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The invention relates to a transformer and a skeleton structure thereof, which can avoid virtual welding of the transformer

A transformer skeleton and transformer technology, applied in the field of transformers, can solve the problems of unstable electrical connection between the transformer and the PCB board, inability to paste the solder to melt, uneven heating of the welding feet, etc., so as to improve the stability of the electrical connection and avoid the The effect of virtual welding and uniform heating

Pending Publication Date: 2019-01-22
深圳市海勤科技有限公司
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing transformer is welded on the PCB board by using reflow soldering technology, but because the bottom of the transformer is close to the PCB board, the hot air flow cannot evenly melt the paste solder on the pad, resulting in soldering The feet are not evenly heated, prone to false soldering, resulting in unstable electrical connection between the transformer and the PCB board

Method used

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  • The invention relates to a transformer and a skeleton structure thereof, which can avoid virtual welding of the transformer
  • The invention relates to a transformer and a skeleton structure thereof, which can avoid virtual welding of the transformer
  • The invention relates to a transformer and a skeleton structure thereof, which can avoid virtual welding of the transformer

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Embodiment Construction

[0039] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0040] A kind of transformer that avoids the virtual welding of transformer, refer to figure 1 , including a skeleton structure 100 , a coil 200 disposed on the skeleton structure 100 , and a welding foot 300 connected to the coil 200 . In this example, combined with figure 1 with figure 2 , the skeleton structure 100 includes a casing 110 and support feet 120 disposed on both sides of the casing 110 . The housing 110 includes an upper housing 111 and a lower housing 112. The upper housing 111 and the lower housing 112 are combined to form a cavity for installing the coil 200. After the coil 200 is installed, the upper housing 111 and the lower housing 112 The connection is fixed by dispensing 400. In this embodiment, the dispensing glue 400 is located on both sides of the supporting legs 120, which can maintain the smoothness of the other two si...

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Abstract

The invention discloses a transformer and a skeleton structure thereof for avoiding virtual welding of the transformer, in accordance with that present invention, include a housing, A support pin is arrange on that housing for support the housing so as to form a gap between the bottom of the housing and the PCB board, The support pins are arranged on the shell of the transformer, so that there isa gap between the transformer and the bottom. In the process of reflow soldering, the thermal reflow at the soldering pins of the transformer is relatively uniform, and the heating is more uniform, soas to avoid dummy soldering and improve the electrical connection stability between the transformer and the PCB board.

Description

technical field [0001] The invention relates to the technical field of transformers, more specifically, it relates to a transformer and its skeleton structure which can avoid transformer virtual welding. Background technique [0002] Due to the continuous miniaturization of PCB boards of electronic products, chip components have appeared, and the traditional soldering method can no longer meet the needs. Therefore, reflow soldering is used in the assembly of hybrid integrated circuit boards. Reflow soldering is the soldering of the mechanical and electrical connections between the surface mount component terminals or pins and the printed board pads by remelting the paste solder that is pre-distributed on the printed board pads. Reflow soldering relies on the action of hot air flow on solder joints, and the gel-like flux performs physical reaction welding under a certain high-temperature air flow, so it is called "reflow soldering" because the gas circulates in the welding ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F27/06H01F27/02
CPCH01F27/02H01F27/06H01F2027/065
Inventor 何圣怡曾华明付冬龙
Owner 深圳市海勤科技有限公司
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